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參數(shù)資料
| 型號(hào)： | DG758BX45 |
| 廠商： | DYNEX SEMICONDUCTOR LTD |
| 元件分類： | 晶閘管 |
| 英文描述： | ER 26C 26#16 SKT PLUG |
| 中文描述： | 1365.9 A, 4500 V, GATE TURN-OFF SCR |
| 封裝： | X, 4 PIN |
| 文件頁(yè)數(shù)： | 2/19頁(yè) |
| 文件大?。?/td> | 216K |
| 代理商： | DG758BX45 |
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DG758BX45
2/19
SURGE RATINGS
Conditions
16.0
1.28 x 10
6
kA
A
2
s
Surge (non-repetitive) on-state current
I
2
t for fusing
10ms half sine. T
j
= 125
o
C
10ms half sine. T
j
=125
o
C
di
T
/dt
Critical rate of rise of on-state current
300
100
V/
μ
s
Max.
Units
Rate of rise of off-state voltage
dV
D
/dt
1000
V/
μ
s
To 66% V
DRM
; V
RG
= -2V, T
j
= 125
o
C
I
TSM
Symbol
Parameter
I
2
t
V
= 3000V, I
T
= 3000A, T
j
= 125
o
C, I
FG
> 40A,
Rise time > 1.0
μ
s
A/
μ
s
To 66% V
DRM
; R
GK
≤
1.5
, T
j
= 125
o
C
GATE RATINGS
Symbol
Parameter
Conditions
V
Units
Max.
16
20
Min.
-
-
-
Peak reverse gate voltage
Peak forward gate current
Average forward gate power
Peak reverse gate power
Rate of rise of reverse gate current
Minimum permissable on time
Minimum permissable off time
24
60
-
50
30
-
-
μ
s
100
100
V
RGM
This value maybe exceeded during turn-off
I
FGM
P
FG(AV)
P
RGM
di
GQ
/dt
t
ON(min)
t
OFF(min)
μ
s
A/
μ
s
kW
W
A
THERMAL RATINGS AND MECHANICAL DATA
Symbol
Parameter
Conditions
Max.
Min.
R
th(c-hs)
Contact thermal resistance
R
th(j-hs)
-
-
0.0392
-
0.0036
o
C/W
per contact
Cathode side cooled
Double side cooled
Units
-
0.0146
o
C/W
Anode side cooled
o
C/W
0.0233
Virtual junction temperature
T
OP
/T
stg
Operating junction/storage temperature range
-
Clamping force
-40
125
37.0
33.0
-40
kN
o
C/W
Clamping force 35.0kN
With mounting compound
DC thermal resistance - junction to heatsink
surface
T
vj
125
o
C
o
C
-
Peak stray inductance in snubber circuit
L
S
200
nH
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