參數(shù)資料
型號(hào): DG9409DN-T1-E4
廠商: Vishay Siliconix
文件頁數(shù): 7/14頁
文件大?。?/td> 0K
描述: IC MUX ANA DUAL 8/4CH 16QFN
標(biāo)準(zhǔn)包裝: 2,500
功能: 多路復(fù)用器
電路: 2 x 4:1
導(dǎo)通狀態(tài)電阻: 7 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 2.7 V ~ 12 V,± 3 V ~ 6 V
電流 - 電源: 1µA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-QFN(4x4)
包裝: 帶卷 (TR)
www.vishay.com
2
Document Number: 71870
S13-1288-Rev. D, 27-May-13
Vishay Siliconix
DG9408, DG9409
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
TRUTH TABLES AND ORDERING INFORMATION
X = Don’t care
For low and high voltage levels for VAX and VEN consult “Digital Control” Parameters for Specific V+ operation. See Specifications
Tables for:
Single Supply 12 V
Dual Supply V+ = 5 V, V- = - 5 V
Single Supply 5 V
Single Supply 3 V
Notes:
a. Signals on SX, DX or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
b. All leads soldered or welded to PC board.
c. Derate 23.5 mW/°C above 70 °C.
d. Manual soldering with soldering iron is not recommended for leadless components. The QFN is a leadless package. The end of the lead
terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper lip cannot
be guaranteed and is not required to ensure adequate bottom side solder interconnection.
TRUTH TABLE DG9408
A2
A1
A0
EN
On Switch
X
1
None
00
0
1
00
1
0
2
01
0
3
01
1
0
4
10
0
5
10
1
0
6
11
0
7
11
1
0
8
TRUTH TABLE DG9409
A1
A0
EN
On Switch
X
1
None
00
0
1
01
0
2
10
0
3
11
0
4
ORDERING INFORMATION
Temp. Range
Package
Part Number
- 40 °C to 85 °C
16-pin QFN (4 mm x 4 mm)
(Variation 1)
DG9408DN-T1-E4
DG9409DN-T1-E4
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Limit
Unit
Voltage Referenced V+ to V-
14
V
GND
7
Digital Inputsa, VS, VD
(V-) - 0.3 to (V+) + 0.3
Current (Any Terminal Except S or D)
30
mA
Continuous Current, S or D
100
Peak Current, S or D (Pulsed at 1 ms, 10 % Duty Cycle max.)
200
Package Solder Reflow Conditionsd
16-pin (4 x 4 mm) QFN
240
°C
Storage Temperature
- 65 to 150
Power Dissipation (Package)b, (TA = 70 °C)
16-pin (4 x 4 mm) QFNc
1880
mW
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