www.powerint.com
A
3/04
Power Integrations 5245 Hellyer Avenue
San Jose, California 95138
MAIN PHONE NUMBER
APPLICATIONS HOTLINE
APPLICATIONS FAX
For a complete listing of worldwide sales offices,
+1 408-414-9200
+1 408-414-9660
+1 408-414-9760
please visit
www.powerint.com
DI-35
The PI logo,
TOPSwitch
,
TinySwitch
,
LinkSwitch
and
EcoSmart
are registered trademarks of Power Integrations.
PI Expert
and
DPA-Switch
Power Integrations may make changes to its products at any time. Power Integrations has no liability arising from your use of any information, device or circuit described
herein nor does it convey any license under its patent rights or the rights of others. POWER INTEGRATIONS MAKES NO WARRANTIES HEREIN AND SPECIFICALLY
DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,
AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. The products and applications illustrated herein (including circuits external to the products and transformer
construction) may be covered by one or more U.S. and foreign patents or potentially by pending U.S. and foreign patent applications assigned to Power Integrations.
A complete list of Power Integrations' patents may be found at
www.powerint.com
.
For the latest updates, visit
www.powerint.com
Table 1. Transformer Construction Information.
Figure 2. 115 VAC V-I Curve.
Figure 3. Load Current for Thermal Test. (10 ms/div)
TRANSFORMER PARAMETERS
Nippon Ceramic EF-25-NC-2H
A
LG
of 247 nH/T
2
Miles-Platts FE0100 with TBS-601
terminals
Primary: 65T, 2 layers, 28 AWG
Secondary: 9T, 2 x 26 AWG, Triple
Insulated
Bias: 8T, 2 x 28 AWG
Primary: 3-1, tape
Secondary: 9,10-6,7, tape,
Bias: 4-5, tape 3L
1059
μ
H
±
10%
0.75 MHz (Min)
28
μ
H (Max)
Core
Bobbin
Winding Details
Winding Order (pin numbers)
Primary Inductance
Primary Resonant Frequency
Leakage Inductance
THERMAL TEST RESULSTS
Test Case
T1 (Transformer)
U1 (TOP245P
C8 (Op Capacitor)
T (
°
C) @
85 VAC
T (
°
C) @
265 VAC
57
59
64
51
58
59
41
40
Thermal test load current is 1 A for 30 ms, 2.2 A for 10 ms
Table 2. Thermal Test with Pulsed Load of Figure 3. 25
°
C
Ambiant, Open Frame, 85 VAC and 265 VAC input.
0
1
I
OUT
(A)
1.5
0.5
2
2.5
V
O
15.5
15.4
15.6
15.1
15.2
15.3
15.9
15.8
16
15.7
16.1
P
P
0
50
100
1
4
3
5
2
Time (ms)
C
6
7
0
2.2 A
1 A
Keep power loop layouts (primary and secondary) tight to
minimize noise (EMI and output ripple) and power loss.
At least 10 cm
2
of PCB copper area should be used for
heatsinking.