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參數(shù)資料
| 型號(hào)： | DIM400GDM33-F |
| 英文描述： | IGBT Modules - Dual Switch |
| 中文描述： | IGBT模塊-雙開(kāi)關(guān) |
| 文件頁(yè)數(shù)： | 10/10頁(yè) |
| 文件大小： | 265K |
| 代理商： | DIM400GDM33-F |
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.
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Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: +44-(0)1522-500500
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e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information:
This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information:
The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information:
The product design is complete and final characterisation for volume production is well in hand.
No Annotation:
The product parameters are fixed and the product is available to datasheet specification.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DIM400PBM17-A | IGBT Modules - Bi-directional Switch |
| DIM400PHM17-A | IGBT Modules - Half Bridge |
| DIM400WHS12-A | IGBT Modules - Half Bridge |
| DIM400WHS12-E | IGBT Modules - Half Bridge |
| DIM400WHS17-A | IGBT Modules - Half Bridge |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DIM400GDM33F000 | 制造商:Dynex Semiconductor 功能描述:POWER IGBT TRANSISTOR |
| DIM400GDM33-F032 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:Dual Switch IGBT Module |
| DIM400LSS12-A000 | 制造商:n/a 功能描述:IGBT Module |
| DIM400LSS17-A000 | 制造商:DYNEX 制造商全稱(chēng):Dynex Semiconductor 功能描述:Single Switch IGBT Module |
| DIM400NSM33F000 | 制造商:Dynex Semiconductor 功能描述:POWER IGBT TRANSISTOR |
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