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參數(shù)資料
| 型號(hào)： | DKF110PFWSTG |
| 廠商： | Fujitsu Limited |
| 英文描述： | Solid-State Fingerprint Sensor |
| 中文描述： | 固態(tài)指紋傳感器 |
| 文件頁數(shù)： | 21/24頁 |
| 文件大?。?/td> | 240K |
| 代理商： | DKF110PFWSTG |
Peimnay
MBF110
Fujitsu Microelectronics, Inc.
17
Manufacturing Considerations
CAUTION: DO NOT USE ANY METAL PICKUP TOOLS WHICH WOULD CONTACT THE SENSOR DEVICE SURFACE WITHOUT
PROTECTIVE LID INSTALLED
Surface Mount reflow temperature:
Recommended
Max Temp
220
°
C Max reflow spike*
240
°
C
Avoid any high pressure spray directly to the sensor device surface.
Use standard handling practices for ESD sensitive devices.
Refer to Fujitsu PCB Assembly for Biometric Sensor Guidelines.
Array Pixel Specifications:
Notes:
1) Failing rows or columns that fall on rows (0-4) or (295-299) or columns (0-4) or (295-299) are allowed to pass for the STD product due to packaging overlap at the edge of the
sensor array. Failed rows or columns at the extreme edge of the array do not affect the quality of the acquired fingerprint image.
Specification
MBF110-LP
MBF110-STD
Max Failed Pixels
10
300
Max Failed Rows
0
1 (see note 1)
Max Failed Columns
0
1 (see note 1)
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