DPS1MX16MKn3
Dense-Pac Microsystems, Inc.
RECOMMENDED OPERATING RANGE
3
Symbol
Characteristic
V
DD
Supply Voltage
V
IH
Input HIGH Voltage
V
IL
Input LOW Voltage -0.5
2
M/B
Min. Typ.
4.5
2.2
Max.
5.5
V
DD
+0.3
0.8
+125
+85
+70
Unit
V
V
V
5.0
T
A
Operating
Temperature
-55
-40
0
+25
+25
+25
o
C
I
C
TRUTH TABLE
Mode
CE
WE
OE
I/O Pin
Supply
Current
Not Selected
D
OUT
Disable
Read
Write
H
L
L
L
X
H
H
L
X
H
L
X
High-Z Standby
High-Z
D
OUT
D
IN
Active
Active
Active
H = HIGH L = LOW X = Don’t Care
DC OUTPUT CHARACTERISTICS
Parameter
Conditions
HIGH Voltage
I
OH
= -4.0mA
LOW Voltage
I
OL
=8.0mA
Symbol
V
OH
V
OL
Min. Max. Unit
2.4
0.4
V
V
ABSOLUTE MAXIMUM RATINGS
3
Parameter
Storage Temperature
Temperature Under Bias
Supply Voltage
1
Input/Output Voltage
1
Symbol
T
STC
T
BIAS
V
DD
V
I/O
Value
Unit
°
C
°
C
°
C
V
-65 to +150
-55 to +125
-0.5 to +7.0
-0.5 to V
DD
+0.5
DC OPERATING CHARACTERISTICS: Over operating ranges
Symbol
Characteristics
Test Conditions
Typ.
()
C
I
M/B
Unit
Min.
Max.
Min.
Max.
Min.
Max.
I
IN
Input
Leakage Current
Output
Leakage Current
Operating
Supply Current
Full Standby
Supply Current
Standby Current (TTL)
Data Retention
Supply Current (3.0V)
Data Retention
Supply Current (2.0V)
Output Low Voltage
Output High Voltage
V
IN
= 0V to V
DD
-
-20
+20
-20
+20
-20
+20
μ
A
I
OUT
V
= 0V to V
DD
,
CE or OE = V
IH
, or WE = V
IL
Cycle=min., Duty=100%
I
OUT
= 0mA
V
IN
≥
V
DD
-0.2V or
V
IN
≤
V
SS
+0.2V
CE = V
IH
-
-20
+20
-20
+20
-20
+20
μ
A
I
CC
X8
X16
185
290
350
460
360
480
36 0
480
mA
I
SB1
4
40
40
60
mA
I
SB2
80
240
240
240
mA
I
DR3
V
DR
= 3.0V, CE
≥
V
DR
-0.2V
0.6
2.0
4.0
8.0
mA
I
DR2
V
DR
= 2.0V, CE
≥
V
DR
-0.2V
0.4
1.2
3.2
7.2
mA
V
OL
V
OH
I
OUT
= 8.0mA
I
OUT
= -4.0mA
-
-
0.4
0.4
0.4
V
V
2.4
2.4
2.4
Typical measurements made at +25
o
C, Cycle = min., V
DD
= 5.0V.
CAPACITANCE
4
: T
A
= 25
°
C, F = 1.0MHz
Symbol
Parameter
C
ADR
Address Input
C
CE
Chip Enable
C
WE
Write Enable
C
OE
Output Enable
C
I/O
Data Input/Output
Max.
40
16
40
25
25
Unit
Condition
pF
V
IN2
= 0V
PIN-OUT DIAGRAM
30A129-04
REV. E
2
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