Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit p" />
參數(shù)資料
型號(hào): DS1321S+T&R
廠商: Maxim Integrated
文件頁(yè)數(shù): 5/13頁(yè)
文件大?。?/td> 0K
描述: IC CTRLR NV W/BATT MON 5V 16SOIC
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
控制器類型: 非易失性 RAM
電源電壓: 4.75 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 帶卷 (TR)
DS1321
13 of 13
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim
reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, Inc. 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
2012 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
DATA SHEET REVISION SUMMARY
The following represent the key differences between 03/26/96 and 06/12/97 version of the DS1321 data
sheet. Please review this summary carefully.
1.
Changed ICCO1 from 200 to 185 mA max
2.
Changed ICCO2 from 350 to 260 mA max
3.
Changed VBTP from 2.55 - 2.65V to 2.50 - 2.70V
4.
Changed RIM from 1.0 typ to 1.2 M and 1.4 max to 1.5 M
5.
Changed tPD from 5 typ, 15 max to 12 typ, 20 max
6.
Changed tRPO units from ns to s
7.
Changed block diagram to show U.L. compliance
The following represent the key differences between 06/12/97 and 09/29/97 version of the DS1321 data
sheet. Please review this summary carefully.
1.
Changed AC test conditions
The following represent the key differences between 09/29/97 and 12/12/97 version of the DS1321 data
sheet. Please review this summary carefully.
1.
Removed preliminary from title bar.
2.
Specified which inputs and outputs are relevant for CIN and COUT specs. This is not a change, just
a clarification.
The following represent the key differences between 12/12/97 and 6/12 version of the DS1321 data sheet.
Please review this summary carefully.
1.
Replace logo and clarify package types.
2.
Update ordering, soldering, and package information; add package thermal data.
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