參數(shù)資料
型號(hào)： DS1344D-33+T&R
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 12/20頁(yè)
文件大?。?/td> 0K
描述： IC RTC SPI 3.3V 14TDFN-EP
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 1
類型： 時(shí)鐘/日歷
特點(diǎn)： 警報(bào)器，閏年，NVRAM，方波輸出，涓流充電器
存儲(chǔ)容量： 96B
時(shí)間格式： HH:MM:SS（12/24 小時(shí)）
數(shù)據(jù)格式： YY-MM-DD-dd
接口： SPI
電源電壓： 3 V ~ 5.5 V
電壓 - 電源，電池： 1.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 14-WFDFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 14-TDFN-EP（3x3）
包裝： 標(biāo)準(zhǔn)包裝
其它名稱： DS1344D-33+T&RDKR
2
Maxim Integrated
Low-Current SPI/3-Wire RTCs
DS1343/DS1344
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Voltage Range on VCC or VBAT
Relative to Ground............................................-0.3V to +6.0V
Voltage Range on Any Nonpower Pin
Relative to Ground................................ -0.3V to (VCC + 0.3V)
Operating Temperature Range.......................... -40NC to +85NC
Junction Temperature Maximum.....................................+150NC
Storage Temperature Range............................ -55NC to +125NC
Lead Temperature (soldering, 10s) ................................+260NC
Soldering Temperature (reflow) ......................................+260NC
RECOMMENDED OPERATING CONDITIONS
(TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
DC ELECTRICAL CHARACTERISTICS
(VCC = VCC(MIN) to +5.5V, VBAT = +1.3V to +5.5V, TA = -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (BJA) ..........91NC/W
Junction-to-Case Thermal Resistance (BJC) ...............20NC/W
TDFN
Junction-to-Ambient Thermal Resistance (BJA) ..........54NC/W
Junction-to-Case Thermal Resistance (BJC) .................8NC/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage Range
VCC
DS134_-18
1.71
1.8
5.5
V
DS134_-3
2.7
3.0
5.5
DS134_-33
3.0
3.3
5.5
Minimum Timekeeping Voltage
VBATTMIN TA = +25NC
1.15
1.3
V
Backup Voltage
VBAT
1.3
5.5
V
Logic 1 Input
VIH
0.7 x
VCC
VCC +
0.3
V
Logic 0 Input
VIL
-0.3
0.3 x
VCC
V
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Supply Active Current
ICCA
-3 or -33: fSCLK = 4MHz (Note 4)
600
F
A
Power-Supply Standby Current
(Note 5)
ICCS
-33: VCC = 3.63V
120
F
A
VCC = VCC(MAX)
160
Backup Leakage Current
IBATLKG
VCC > VPF
-100
+25
+100
nA
Backup Current (Oscillator Off)
IBAT
TA = +25NC, VCC = 0V, EOSC = 1
100
nA
Backup Current
(Note 6)
DS1343
IBAT1
VBAT = 3V
250
nA
VBAT = VBAT(MAX)
500
DS1344
VBAT = 3V
350
VBAT = VBAT(MAX)
600
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