- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄376976 > DS3173N Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers PDF資料下載
參數(shù)資料
| 型號： | DS3173N |
| 英文描述： | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
| 中文描述： | 單/雙/三/四DS3/E3單芯片收發(fā)器 |
| 文件頁數(shù)： | 210/232頁 |
| 文件大?。?/td> | 2133K |
| 代理商： | DS3173N |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁第189頁第190頁第191頁第192頁第193頁第194頁第195頁第196頁第197頁第198頁第199頁第200頁第201頁第202頁第203頁第204頁第205頁第206頁第207頁第208頁第209頁當(dāng)前第210頁第211頁第212頁第213頁第214頁第215頁第216頁第217頁第218頁第219頁第220頁第221頁第222頁第223頁第224頁第225頁第226頁第227頁第228頁第229頁第230頁第231頁第232頁
DS3171/DS3172/DS3173/DS3174
210 of 232
Table 13-1. JTAG Instruction Codes
INSTRUCTIONS
EXTEST
IDCODE
SAMPLE/PRELOAD
CLAMP
HIGHZ
—
—
BYPASS
SELECTED REGISTER
Boundary Scan
Device Identification
Boundary Scan
Bypass
Bypass
Bypass
Bypass
Bypass
INSTRUCTION CODES
000
001
010
011
100
101
110
111
SAMPLE/PRELOAD.
This is a mandatory instruction for the IEEE 1149.1 specification. This instruction supports
two functions. The digital I/Os of the device can be sampled at the boundary scan register without interfering with
the normal operation of the device and the boundary scan register can be pre-loaded for the EXTEST instruction.
The positive edge of JTCLK in the Capture
-
DR state samples all digital input pins into the boundary scan register.
The boundary scan register is connected between JTDI and JTDO. The data on JTDI pin is clocked into the
boundary scan register and the data captured in the Capture-DR state is shifted out the TDO pin in the Shift
-
DR
state.
EXTEST.
This is a mandatory instruction for the IEEE 1149.1 specification. This instruction allows testing of all
interconnections to the device. When the EXTEST instruction is latched in the instruction register, the following
actions occur. Once enabled by the Update
-
IR state, the parallel outputs of all digital output pins are driven
according to the values in the boundary scan registers on the positive edge of JTCLK. The boundary scan register
is connected between JTDI and JTDO. The positive edge of JTCLK in the Capture
-
DR state samples all digital
input pins into the boundary scan register. The negative edge of JTCLK in the Update-DR state causes all of the
digital output pins to be driven according to the values in the boundary scan registers that have been shifted in
during the Shift-DR state. The outputs are returned to their normal mode or HIZ mode at the positive edge of
JTCLK during the Update-IR state when an instruction other than EXTEST or CLAMP is activated.
BYPASS.
This is a mandatory instruction for the IEEE 1149.1 specification. When the BYPASS instruction is
latched into the parallel instruction register, JTDI connects to JTDO through the 1
-
bit bypass test register. This
allows data to pass from JTDI to JTDO not affecting the device’s normal operation. This mode can be used to
bypass one or more chips in a system with multiple chips that have their JTAG scan chain connected in series. The
chips not in bypass can then be tested with the normal JTAG modes.
IDCODE.
This is a mandatory instruction for the IEEE 1149.1 specification. When the IDCODE instruction is
latched into the parallel instruction register, the identification test register is selected. The device identification code
is loaded into the identification register on the rising edge of JTCLK following entry into the Capture
-
DR state. Shift
-
DR can be used to shift the identification code out serially through JTDO. During Test
-
Logic
-
Reset, the
identification code is forced into the instruction register’s parallel output.
HIGHZ.
All digital outputs are placed into a high-impedance state. The bypass register is connected between JTDI
and JTDO. The outputs are put into the HIZ mode when the HIZ instruction is loaded in the Update-IR state and on
the positive edge of JTCLK. The outputs are returned to their normal mode or driven from the boundary scan
register at the positive edge of JTCLK during the Update-IR state when an instruction other than HIZ is activated.
CLAMP.
All digital output pins output data from the boundary scan parallel output while connecting the bypass
register between JTDI and JTDO. The outputs do not change during the CLAMP instruction. If the previous
instruction was not EXTEST, the outputs will be driven according to the values in the boundary scan register at the
positive edge of JTCLK in the Update-IR state. The typical use of this instruction is in a system that has the JTAG
scan chain of multiple chips connected in series, and all of the chips have their outputs initialized using the
EXTEST mode. Then some of the chips are left initialized using the CLAMP mode and others have their IO
controlled using the EXTEST mode. This reduces the size of the scan chain during the partial testing of the system.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DS3174 | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
| DS3174N | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
| DS318PIN | Industrial Control IC |
| DS319 | Two-Way Power Divider 10500 MHz |
| DS109333 | Two-Way Power Divider 10500 MHz |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS3174 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3174+ | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3174DK | 功能描述:網(wǎng)絡(luò)開發(fā)工具 RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V |
| DS3174N | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3174N+ | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。