Accurate I2C RTC with Integrated TCXO/Crystal/FRAM _____________" />
參數(shù)資料
型號: DS32C35-33#
廠商: Maxim Integrated Products
文件頁數(shù): 18/22頁
文件大小: 0K
描述: IC RTC W/TCXO 20-SOIC
產(chǎn)品變化通告: Product Discontinuation 28/Nov/2011
標準包裝: 37
類型: 時鐘/日歷
特點: 警報器,F(xiàn)RAM,閏年,方波輸出,TCXO/晶體
存儲容量: 8KB
時間格式: HH:MM:SS(12/24 小時)
數(shù)據(jù)格式: YY-MM-DD-dd
接口: I²C,2 線串口
電源電壓: 2.7 V ~ 3.63 V
電壓 - 電源,電池: 2.3 V ~ 3.6 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應商設備封裝: 20-SOIC W
包裝: 管件
產(chǎn)品目錄頁面: 1433 (CN2011-ZH PDF)
DS32B35/DS32C35
Accurate I2C RTC with Integrated
TCXO/Crystal/FRAM
_____________________________________________________________________
5
POWER-SWITCH CHARACTERISTICS
(TA = -40°C to +85°C, Note 2, see the Power-Switch Timing diagram.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC Fall Time; VPF(MAX) to
VPF(MIN)
tVCCF
300
μs
VCC Rise Time; VPF(MIN) to
VPF(MAX)
tVCCR
0
μs
Recovery at Power-Up
tREC
(Note 14)
300
ms
Note 2:
Limits at -40°C are guaranteed by design and not production tested.
Note 3:
All voltages are referenced to ground.
Note 4:
To minimize current drain on VBAT when the internal supply is switched to VBAT, the VIH minimum must be higher than
VBAT - 0.6V. Otherwise, there is significant current drain due to the input stage at the SCL and SDA pins.
Note 5:
The pullup resistor voltage on the 32kHz and INT/SQW pins can be up to 5.5V maximum regardless of the voltage on VCC.
Note 6:
Current is the averaged input current, which includes the temperature conversion current.
Note 7:
The RST pin has an internal 50k
Ω (nominal) pullup resistor to VCC.
Note 8:
After this period, the first clock pulse is generated.
Note 9:
A device must internally provide a hold time of at least 300ns for the SDA signal (referred to as the VIH(MIN) of the SCL sig-
nal) to bridge the undefined region of the falling edge of SCL.
Note 10: The maximum tHD:DAT needs only to be met if the device does not stretch the low period (tLOW) of the SCL signal.
Note 11: A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT
≥ 250ns must then be met. This
is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the
low period of the SCL signal, it must output the next data bit to the SDA line tR(MAX) + tSU:DAT = 1000 + 250 = 1250ns
before the SCL line is released.
Note 12: CB—total capacitance of one bus line in pF.
Note 13: The parameter tOSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of
0.0V
≤ VCC ≤ VCC(MAX) and 2.0V ≤ VBAT ≤ 3.6V.
Note 14: This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, tREC is bypassed and RST immedi-
ately goes high. The state of RST does not affect the I2C interface, RTC, TCXO, or FRAM operation.
WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.
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