參數(shù)資料
型號(hào)： DSP56F801FA80E
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 8/48頁(yè)
文件大?。?/td> 0K
描述： IC DSP 60MHZ 16KB FLASH 48-LQFP
標(biāo)準(zhǔn)包裝： 250
系列： 56F8xx
核心處理器： 56800
芯體尺寸： 16-位
速度： 80MHz
連通性： SCI，SPI
外圍設(shè)備： POR，PWM，WDT
輸入/輸出數(shù)： 11
程序存儲(chǔ)器容量： 20KB（10K x 16）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 2K x 16
電壓 - 電源 (Vcc/Vdd)： 3 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 48-LQFP
包裝： 托盤
56F801 Technical Data, Rev. 17
16
Freescale Semiconductor
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
2.
Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where s is the number of signal layers and p is the number
of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the
non-single layer boards is Theta-JMA.
3.
Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values
using the cold plate technique with the cold plate temperature used as the "case" temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
4.
Thermal Characterization Parameter, Psi-JT (
Ψ
JT ), is the "resistance" from junction to reference point
thermocouple on top center of case as defined in JESD51-2.
Ψ
JT is a useful value to use to estimate junction
temperature in steady state customer environments.
5.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
6.
See Section 5.1 from more details on thermal design considerations.
7.
TJ = Junction Temperature
TA = Ambient Temperature
Table 3-3 Thermal Characteristics6
Characteristic
Comments
Symbol
Value
Unit
Notes
48-pin LQFP
Junction to ambient
Natural convection
RθJA
50.6
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
47.4
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
39.1
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
37.9
°C/W
1,2
Junction to case
RθJC
17.3
°C/W
3
Junction to center of case
Ψ
JT
1.2
°C/W
4, 5
I/O pin power dissipation
P I/O
User Determined
W
Power dissipation
P D
P D = (IDD x VDD + P I/O)W
Junction to center of case
PDMAX
(TJ - TA) /R
θJA
W7
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