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PIC18F2450/4450
DS39760D-page 274
2008 Microchip Technology Inc.
Supply Current (IDD)(2)
PIC18LF2450/4450
13
40
μA-40°C
VDD = 2.0V
FOSC = 32 kHz(3)
(SEC_RUN mode,
Timer1 as clock)
15
40
μA+25°C
17
40
μA+85°C
PIC18LF2450/4450
40
76
μA-40°C
VDD = 3.0V
32
70
μA+25°C
25
67
μA+85°C
All devices 100
150
μA-40°C
VDD = 5.0V
80
150
μA+25°C
70
150
μA+85°C
PIC18LF2450/4450
5.6
12
μA-40°C
VDD = 2.0V
FOSC = 32 kHz(3)
(SEC_IDLE mode,
Timer1 as clock)
7.0
12
μA+25°C
8.3
12
μA+85°C
PIC18LF2450/4450
6.5
15
μA-40°C
VDD = 3.0V
8.0
15
μA+25°C
9.5
15
μA+85°C
All devices
8.7
25
μA-40°C
VDD = 5.0V
10.2
25
μA+25°C
13.0
36
μA+85°C
21.2
DC Characteristics:
Power-Down and Supply Current
PIC18F2450/4450 (Industrial)
PIC18LF2450/4450 (Industrial) (Continued)
PIC18LF2450/4450
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
PIC18F2450/4450
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
Param
No.
Device
Typ
Max
Units
Conditions
Legend:
Shading of rows is to assist in readability of the table.
Note 1:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2:
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.
3:
Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended
temperature crystals are available at a much higher cost.
4:
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.