參數(shù)資料
型號: DSPIC30F5013T-20E/PT
廠商: Microchip Technology
文件頁數(shù): 145/220頁
文件大?。?/td> 0K
描述: IC DSPIC MCU/DSP 66K 80TQFP
產(chǎn)品培訓模塊: Asynchronous Stimulus
標準包裝: 1,200
系列: dsPIC™ 30F
核心處理器: dsPIC
芯體尺寸: 16-位
速度: 20 MIPS
連通性: CAN,I²C,SPI,UART/USART
外圍設備: AC'97,欠壓檢測/復位,I²S,LVD,POR,PWM,WDT
輸入/輸出數(shù): 68
程序存儲器容量: 66KB(22K x 24)
程序存儲器類型: 閃存
EEPROM 大?。?/td> 1K x 8
RAM 容量: 4K x 8
電壓 - 電源 (Vcc/Vdd): 2.5 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 16x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 125°C
封裝/外殼: 80-TQFP
包裝: 帶卷 (TR)
配用: DM300024-ND - KIT DEMO DSPICDEM 1.1
XLT80PT3-ND - SOCKET TRAN ICE 80MQFP/TQFP
AC164320-ND - MODULE SKT MPLAB PM3 80TQFP
DM300004-2-ND - BOARD DEMO DSPICDEM.NET 2
DM300004-1-ND - BOARD DEMO DSPICDEM.NET 1
AC30F007-ND - MODULE SKT FOR DSPIC30F 80TQFP
其它名稱: DSPIC30F5013T20EP
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁當前第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁第189頁第190頁第191頁第192頁第193頁第194頁第195頁第196頁第197頁第198頁第199頁第200頁第201頁第202頁第203頁第204頁第205頁第206頁第207頁第208頁第209頁第210頁第211頁第212頁第213頁第214頁第215頁第216頁第217頁第218頁第219頁第220頁
dsPIC30F5011/5013
DS70116J-page 30
2011 Microchip Technology Inc.
3.2.2
DATA SPACES
X data space is used by all instructions and supports all
Addressing modes. There are separate read and write
data buses. The X read data bus is the return data path
for all instructions that view data space as combined X
and Y address space. It is also the X address space
data path for the dual operand read instructions (MAC
class). The X write data bus is the only write path to
data space for all instructions.
The X data space also supports modulo addressing for
all instructions, subject to Addressing mode restric-
tions. Bit-reversed addressing is only supported for
writes to X data space.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to
provide two concurrent data read paths. No writes
occur across the Y bus. This class of instructions dedi-
cates two W register pointers, W10 and W11, to always
address Y data space, independent of X data space,
whereas W8 and W9 always address X data space.
Note that during accumulator write back, the data
address space is considered a combination of X and Y
data spaces, so the write occurs across the X bus.
Consequently, the write can be to any address in the
entire data space.
The Y data space can only be used for the data
prefetch operation associated with the MAC class of
instructions. It also supports modulo addressing for
automated circular buffers. Of course, all other instruc-
tions can access the Y data address space through the
X data path as part of the composite linear space.
The boundary between the X and Y data spaces is
defined as shown in Figure 3-6 and is not user pro-
grammable. Should an EA point to data outside its own
assigned address space, or to a location outside phys-
ical memory, an all zero word/byte will be returned. For
example, although Y address space is visible by all
non-MAC instructions using any Addressing mode, an
attempt by a MAC instruction to fetch data from that
space using W8 or W9 (X space pointers) will return
0x0000.
TABLE 3-2:
EFFECT OF INVALID
MEMORY ACCESSES
All effective addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words.
3.2.3
DATA SPACE WIDTH
The core data width is 16 bits. All internal registers are
organized as 16-bit wide words. Data space memory is
organized in byte addressable, 16-bit wide blocks.
3.2.4
DATA ALIGNMENT
To help maintain backward compatibility with PIC
MCU devices and improve data space memory usage
efficiency, the dsPIC30F instruction set supports both
word and byte operations. Data is aligned in data mem-
ory and registers as words, but all data space EAs
resolve to bytes. Data byte reads will read the complete
word which contains the byte, using the LSb of any EA
to determine which byte to select. The selected byte is
placed onto the LSB of the X data path (no byte
accesses are possible from the Y data path as the MAC
class of instruction can only fetch words). That is, data
memory and registers are organized as two parallel
byte wide entities with shared (word) address decode
but separate write lines. Data byte writes only write to
the corresponding side of the array or register which
matches the byte address.
As a consequence of this byte accessibility, all effective
address calculations (including those generated by the
DSP operations which are restricted to word sized
data) are internally scaled to step through word aligned
memory. For example, the core would recognize that
Post-Modified Register Indirect Addressing mode
[Ws++] will result in a value of Ws+1 for byte operations
and Ws+2 for word operations.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported so
care must be taken when mixing byte and word opera-
tions, or translating from 8-bit MCU code. Should a mis-
aligned read or write be attempted, an address error
trap will be generated. If the error occurred on a read,
the instruction underway is completed, whereas if it
occurred on a write, the instruction will be executed but
the write will not occur. In either case, a trap will then
be executed, allowing the system and/or user to exam-
ine the machine state prior to execution of the address
fault.
FIGURE 3-8:
DATA ALIGNMENT
Attempted Operation
Data Returned
EA = an unimplemented address
0x0000
W8 or W9 used to access Y data
space in a MAC instruction
0x0000
W10 or W11 used to access X
data space in a MAC instruction
0x0000
15
8 7
0
0001
0003
0005
0000
0002
0004
Byte1
Byte 0
Byte3
Byte 2
Byte5
Byte 4
LSB
MSB
相關PDF資料
PDF描述
VI-2TY-IX-S CONVERTER MOD DC/DC 3.3V 49.5W
VI-2TY-IW-S CONVERTER MOD DC/DC 3.3V 66W
VI-2TX-IY-S CONVERTER MOD DC/DC 5.2V 50W
VI-2TV-IY-S CONVERTER MOD DC/DC 5.8V 50W
VI-2T0-IY-S CONVERTER MOD DC/DC 5V 50W
相關代理商/技術(shù)參數(shù)
參數(shù)描述
DSPIC30F5013T-20I/PT 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 20MHz 66KB Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
DSPIC30F5013T-20I/PTG 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 20MHz 66KB Flash Lead Free Package RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
DSPIC30F5013T-30I/PT 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 30MHz 66KB Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
DSPIC30F5013T-30I/PTG 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 30MHz 66KB Flash Lead Free Package RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
dsPIC30F5015-20E/PT 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 20MIPS 66 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT