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參數(shù)資料
| 型號： | DTMF13-3P |
| 廠商： | DEUTSCH ENGINEERED CONNECTING DEVICES |
| 元件分類： | 組合線連接器 |
| 英文描述： | 3 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER, RECEPTACLE |
| 文件頁數(shù)： | 2/8頁 |
| 文件大小： | 1616K |
| 代理商： | DTMF13-3P |
Dielectric Withstanding Voltage
Current leakage less than 2 milliamps at
1500 VAC.
Current Rating
125o C continuous
Contact Size
Max Current
#20
7.5 amps
#16
1.3 amps
Durability
No electrical or mechanical defects after 100
cycles of engagement or disengagement.
Physical Shock
No unlocking, unmating or other
unsatisfactory results after 50 g’s in each of
three mutually perpendicular planes.
Moisture Resistance
Water does not penetrate seals when
submerged in three feet of water.
Vibration
Maintains continuity and exhibits no
mechanical or physical damage after
vibration levels of 20 g’s between limits of
10 to 2000 Hz.
Temperature
Operative at temperatures from -55o C to
+125o C at rated current.
Thermal Shock
No cracking, chipping or leaking after five
cycles from -55o C to +125o C.
Insulation Resistance
1000 megaohms minimum at 25o C.
Fluid Resistance
Connectors show no damage when exposed
to most fluids used in industrial applications.
Material Specifications
Housing .... Thermoplastic
Seals ......... Silicone Elastomer
Contacts ... Copper Alloy, Tin Plated,
Gold (optional)
.149
(3.78)
PCB LAYOUT
.215
.676
DEUTSCH
DTF13-3P
.764
.341
HOLE FOR PIN
HOLE FOR
FASTENER
PCB LAYOUT
.926
(23.52)
.062+.002
(1.56+.05)
.710
(18.03)
.760
(19.30)
.120+.015
(3.05+.38)
2
1
1.191
(30.24)
3D VIEW
.120+.015
(3.05+.38)
3D VIEW
1.029
(26.13)
1.070
(20.22)
.840
(21.34)
.796
(20.22)
.926
(22.52)
DT 4PIN
INTERFACE
.062+.002
(1.56+.05)
.120+.015
(3.05+.38)
.088 REF
.359
3 WAY RECEPTACLE 90o FLANGELESS
1.318
(33.46)
.175
HOLE FOR
FASTENER
HOLE FOR PIN
4 WAY RECEPTACLE 90o FLANGELESS
2
Electronic Packaging Capabilities
Low Profile Flangeless PCB Connector
PCB LAYOUT
HOLE FOR PIN
HOLE FOR
FASTENER
.715
(18.16)
DT 2 PIN
Interface
.820
3D VIEW
2 WAY RECEPTACLE 90o FLANGELESS
A STEP AHEAD
Electronic Packaging Capabilities 12 28.indd 2
7/31/2008 11:31:43 AM
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