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Tyco Electronics Corp.
15
Data Sheet
June 1997
36 Vdc to 75 Vdc Input; Dual Outputs; 25 W
DW025 Dual Output-Series Power Modules: dc-dc Converters;
Thermal Considerations (continued)
Air Velocity (continued)
8-988(C)
Figure 20. Total Power Dissipation vs. Local
Ambient Temperature and Air Velocity
8-989(C)
Figure 21. Case-to-Ambient Thermal Resistance vs.
Air Velocity
Use of Heat Sinks and Cold Plates
The DW025-Series case includes through-threaded
M3 x 0.5 mounting holes allowing attachment of heat
sinks or cold plates from either side of the module. The
mounting torque must not exceed 0.56 N/m (5 in.-lb.).
The following thermal model can be used to determine
the required thermal resistance of the sink to provide
the necessary cooling:
where PD is the power dissipated by the module,
θCS
represents the interfacial contact resistance between
the module and the sink, and
θSA is the sink-to-ambient
thermal impedance (°C/W). For thermal grease or foils,
a value of
θCS = 0.1 °C/W—0.3 °C/W is typical.
The required
θSA is calculated from the following equa-
tion:
θSA = [(Tc – TA)/PD] – θCS
Note that this equation assumes that all dissipated
power must be shed by the heat sink. Depending on
the user-dened application environment, a more accu-
rate model including heat transfer from the sides and
bottom of the module can be used. This equation pro-
vides a conservative estimate in such instances.
For further information, refer to the
Thermal Energy
Management CC-, CW-, DC-, and DW-Series 25 W
to 30 W Board-Mounted Power Modules Technical
Note.
40
50
60
90
100
0.0
4.0
5.0
6.0
10.0
LOCAL AMBIENT TEMPERATURE, TA (
°C)
7.0
8.0
9.0
70
80
3.0
2.0
1.0
2.03 ms –1 (400 ft./min)
NATURAL
CONVECTION
1.02 ms –1 (200 ft./min)
TOTAL
POWER
DISSIPATION,
P
D
(W)
0.51 ms –1 (100 ft./min)
0.31 ms –1 (60 ft./min)
NAT
CONV
0.25
(50)
0.51
(100)
0.76
(150)
1.78
(350)
2.03
(400)
0.0
1.0
2.0
3.0
7.0
VELOCITY ms –1 (ft./min.)
4.0
5.0
6.0
1.02
(200)
1.27
(250)
1.52
(300)
THERMAL
RESISTANCE
CASE
TO
AMBIENT
(
°C/W)
PD
θCS
TA
Tc
l
Ts
θSA