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參數(shù)資料
| 型號： | DWP35 |
| 廠商： | IXYS Corporation |
| 英文描述： | DIODE ZENER SINGLE 300mW 7.5Vz 20mA-Izt 0.0254 0.1uA-Ir 6 SOT-23 3K/REEL |
| 中文描述： | 整流二極管 |
| 文件頁數(shù)： | 4/22頁 |
| 文件大小： | 765K |
| 代理商： | DWP35 |
4
2004 IXYS All rights reserved
MOS/IGBT Chips
Recommended Solder System
IXYS recommends a soft solder chip attach using a solder composition of 92.5 % Pb, 5 % Sn and 2.5 % Ag. The maximum chip attach
temperature is 460°C for MOSFET and 360°C for HiPerFET
TM
and IGBT.
Wire Bonding
It is recommended to use wire of diameter not greater than 0.38 mm (0.015") for bonding to the source emitter and gate pads. Multiple
wires should be used in place of thicker wire to handle high drain or emitter currents. See tables for number of recommended wire
bonds. At smaller gate pads 0.15 mm is recommended.
Thermal Response Testing
To assure good chip attach processing, thermal response testing per MIL STD 750, Method 3161 or equivalent should be performed.
Bipolar Chips
Assembling
IXYS bipolar semiconductor chips have a soft-solderable, multi-layer metallization (Ti/Ni/Ag) on the bottom side and, on top, either
the same metallization scheme or an alumunium layer sufficiently thick for ultrasonic bonding. Note that the last layer of metal for
soldering is pure silver.
Regardless of their type all chips possess the same glass passivated junction termination system on top of the chip. For that reason
they can be easily chip bonded or they can all be simply soldered to a flat contacting electrode in accordance to the General Rules on
Page 3. All kinds of the usual soft solders with melting points below 660°F (350°C) can be used thanks to their pure silver top metal.
Solders with high melting points are preferable due to their better power cycling capability, i.e. they are more resistant to thermal
fatigue.
Soldering temperature should not exceed 750°F (400°C). The maximum temperature should not be applied for more than five
minutes.
As already mentioned above the electrical properties quoted in the data sheets can only be obtained with properly assembled chips.
This is only possible when all contact materials to be soldered together are well wetted and the solder is practically free of voids.
A simple means to achieve good solder connections is to use a belt furnace running with a process gas containing at least 10 %
Hydrogen in Nitrogen.
Other approved methods are also allowed, provided that the above mentioned temperature-time-limits are not exceeded and
temperature shocks above 930°F/min (500 K/min) are avoided.
We do not recommend the use of fluxes for soldering!
Ultrasonic Wire Bonding
Chips provided with a thick aluminium layer are designed for ultrasonic wire bonding. Wire diameters up to 500 μm can be used
dependent on chip types. Setting wires in parallel and application of stitch bonding lead to surge current ratings comparable to
soldered chips.
Coating
Although the chips are glass passivated, they must be protected against arcing and environmental influences. The coating material
that is in contact with the chip surface must have the following properties:
- elasticity (to prevent mechanical stress)
- high purity, no contamination with alkali metals
- good adhesion to metals and glass passivation.
Assembly Instructions
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