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MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.DATE
ECLIPTEK CORP.
OSCILLATOR
E13C5
CERAMIC
2.5V
OS6W
07/09
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
MARKING SPECIFICATIONS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
E15C5 E 2 F - 155.520M TR
PART NUMBERING GUIDE
AVAILABLE OPTIONS
Blank=Bulk
TR=Tape & Reel
FREQUENCY
LOGIC CONTROL/ADDITIONAL OUTPUT
F=Complementary Output and Tri-State
DUTY CYCLE
2=50 ±5(%)
FREQUENCY TOLERANCE & STABILITY/
OPERATING TEMPERATURE RANGE
C=±100ppm Maximum over 0°C to +70°C
D=±50ppm Maximum over 0°C to +70°C
E=±25ppm Maximum over 0°C to +70°C
F=±20ppm Maximum over 0°C to +70°C
G=±100ppm Maximum over -40°C to +85°C
H=±50ppm Maximum over -40°C to +85°C
J=±25ppm Maximum over -40°C to +85°C
Pin 1: Tri-State
Pin 2: No Connect
Pin 3: Case Ground
Pin 4: Output
Pin 5: Complementary Output
Pin 6: Supply Voltage
A
B
C
D
E
F
16±0.3
7.5±0.1
6.75±0.1
4.0±0.1
2.0±0.1
F
G
H
J
K
L
8.0±0.1
B0*
1.5 +0.1-0.0
A0*
0.3 ±0.1
K0*
TAPE
M
N
O
P
Q
1.5 MIN
50 MIN
20.2 MIN 13.0±0.2
40 MIN
R
S
T
U
V
QTY/REEL
2.5 MIN
10 MIN
18.4 MAX
180 MAX
12.4+2-0
1,000
REEL
*Compliant to EIA 481A
Tolerances= +0.1
1.40
(X6)
1.00
(X6)
0.80
0.27
Solder Land
(X6)
3.20
±0.15
1.30
MAX
1.20
±0.15
1
2
3
6
5
4
1.27
±0.15
1.00
±0.15
0.64
±0.10
2.54
±0.15
5.00
±0.15
Line 1: EXX.XXX
Frequency in MHz (5 Digits Maximum + Decimal)
Line 2: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
Characteristic
Specification
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A