![](http://datasheet.mmic.net.cn/10000/EB52E8E3V-14-400MTR_datasheet_1433902/EB52E8E3V-14-400MTR_1.png)
Pb
RoHS
EB52E8E3V-14.400M TR
EB52E8 E 3 V -14.400M TR
Series
RoHS Compliant (Pb-free) 5mm x 7mm Ceramic SMD
3.3Vdc LVCMOS TC(VC)XO
Operating Temperature Range
-40°C to +85°C
Frequency Stability
±1.0ppm Maximum
Packaging Options
Tape & Reel
Nominal Frequency
14.400MHz
Control Voltage
1.65Vdc ±1.65Vdc
ELECTRICAL SPECIFICATIONS
Nominal Frequency
14.400MHz
Frequency Tolerance
±1.0ppm Maximum (Measured at 25°C ±2°C, at Vdd=3.3Vdc and Vc=1.65Vdc)
Frequency Stability
±1.0ppm Maximum (Inclusive of Operating Temperature Range. Measured at Vdd=3.3Vdc and
Vc=1.65Vdc)
Frequency Stability vs. Input Voltage
±0.3ppm Maximum (±5%)
Frequency Stability vs. Aging
±1ppm/year Maximum (at 25°C)
Frequency Stability vs. Load
±0.3ppm Maximum (±10%)
Operating Temperature Range
-40°C to +85°C
Supply Voltage
3.3Vdc ±5%
Input Current
10mA Maximum
Output Voltage Logic High (Voh)
90% of Vdd Minimum (IOH = -4mA)
Output Voltage Logic Low (Vol)
10% of Vdd Maximum (IOL = +4mA)
Rise/Fall Time
5nSec Maximum (Measured at 20% to 80% of Waveform)
Duty Cycle
50 ±5(%) (Measured at 50% of Waveform)
Load Drive Capability
15pF Maximum
Output Logic Type
CMOS
Control Voltage
1.65Vdc ±1.65Vdc
Control Voltage Range
0.0Vdc to Vdd
Frequency Deviation
±5ppm Minimum
Linearity
5% Maximum
Transfer Function
Positive Transfer Characteristic
Input Impedance
100kOhms Minimum
Phase Noise
-80dBc/Hz at 10Hz Offset, -115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -145dBc/Hz at
>=10kHz Offset (Typical Values at 12.800MHz)
Tri-State Input Voltage (Vih and Vil)
+0.9Vdd Minimum to Enable Output; +0.1Vdd Maximum to Disable Output (High Impedance); No Connect
to Enable Output
RMS Phase Jitter
1pSec Maximum (Fj = 12kHz to 20MHz)
Start Up Time
10mSec Maximum
Storage Temperature Range
-40°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
Gross Leak Test
MIL-STD-883, Method 1014 Condition C
Mechanical Shock
MIL-STD-202, Method 213 Condition C
Resistance to Soldering Heat
MIL-STD-202, Method 210
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010
Vibration
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/11/2011 | Page 1 of 6