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參數資料
| 型號： | EB85L24SGFXI |
| 廠商： | VISHAY DALE |
| 元件分類： | 邊緣插接連接器 |
| 英文描述： | 48 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER |
| 文件頁數： | 1/4頁 |
| 文件大小： | 119K |
| 代理商： | EB85L24SGFXI |
Edgeboard Connectors, Dual Readout
www.vishay.com
For technical questions, contact: connectors@vishay.com
Document Number: 36005
14
Revision: 16-Feb-09
EB8
Vishay Dale
ELECTRICAL SPECIFICATIONS
Current Rating: 5 A
Test Voltage Between Contacts:
At sea level: 1800 VRMS
At 70 000 feet (21 336 meters): 450 VRMS
Insulation Resistance: 5000 M
Ω minimum at 500 V
DC
potential
Contact Resistance: 30 mV maximum at rated current (with
gold plating)
Operating Temperature: - 55 °C to + 125 °C
Humidity: 96 h at 90 % relative humidity at + 40 °C, dried at
room temperature for 3 h minimum, insulation resistance
was greater than 5000 M
Ω
Durability: (With gold plating) After 500 cycles of insertion
and withdrawal of a 0.070" (1.78 mm) thick steel test
gauge, contact resistance less than 0.030 V at 5 A and
individual contact retention force when measured with 0.054"
(1.37 mm) thick steel test slug greater than oz.
Shock:
Three
50G
shocks
in
each
of
3
mutually
perpendicular planes with no loss of continuity
Vibration: 2 h in each of 3 mutually perpendicular planes,
frequency sweep 10 cps to 55 cps at 0.06 double amplitude
with no loss of continuity
PHYSICAL SPECIFICATIONS
Contact Type: Bifurcated bellows
Number of Contacts: 6, 10, 12, 15, 18, 22, 24, 25 per side
Contact Spacing: 0.156" (3.96 mm) center to center
Card Thickness: 0.054" to 0.071" (1.37 mm to 1.80 mm)
Card Slot Depth: Dual readout = 0.330" (8.38 mm)
Note
High
temperature
burn-in,
edgeboard
connectors,
0.156"
(3.96 mm) center to center are on www.vishay.com/doc?36006
FEATURES
0.156" C-C x 0.200" grid (3.96 mm x 5.08 mm)
Greater design latitude
3
body
materials:
Diallyl
phthalate,
phenolic
and
glass-filled polyester
6 contact termination styles, 8 body sizes, 7 mounting
styles
Bifurcated bellows contacts provide 2 flexing contact
surfaces to assure positive contact
Accepts PC board thickness of 0.054" to 0.071" (1.37 mm
to 1.80 mm)
Polarization between contact positions in all sizes
Selective gold plating
Recognized
under
the
Component
Program
of
Underwriters Laboratories, Inc. listed under file
E65524, project 77CH3889
APPLICATIONS
For use with 0.062" (1.57 mm) printed circuit boards requiring
an edgeboard type connector on 0.156" (3.96 mm) centers
MATERIAL SPECIFICATIONS
Body:
“1” glass-filled diallyl phtalate per MIL-M-14, type SDG-F
green, flame retardant (UL 94 V-0)
“2” glass-filled phenolic per MIL-M-14, type MFH dark green,
flame retardant (UL 94 V-0)
“3”
thermoplastic
polyester,
glass-filled,
black,
flame
retardant (UL 94 V-0)
“5” thermoplastic polyphenylene sulfied, glass-filled, brown,
flame retardant (UL 94 V-0)
Contacts: Phosphor bronze
Polarizing Key: Glass reinforced nylon, flame retardant
(UL 94H-B)
Contact Plating: Gold (See Ordering Information)
ORDERING INFORMATION
EB8
1
B
A
22
SG
X
A
MODEL BODY MATERIAL
Optional body
material
1 = Diallyl
phthalate
2 = Phenolic
3 = Glass-filled
polyester
5 = Glass-filled
polyphenylene
sulfied
OPTIONAL
CONTACTS
Beryllium copper
contacts optional.
Available in “A”
and “E” contact
styles only (Omit
for standard)
STANDARD
TERMINAL
VARIATIONS
A, C, D,
K, L, or E
CONTACTS
PER SIDE
6, 10, 12,
15, 18, 22,
24 or 25
CONTACT PLATING
SG = Selective gold plating
(0.00003" (0.000762 mm)
minimum thick) on contact area
with gold flash on terminal
SGF = Selective gold plating
(0.000010" (0.000254 mm)
minimum thick) on contact area
with gold flash on terminal.
All gold plating over 0.00005"
(0.00127 mm) minimum nickel
underplate.
Contact factory for additional
plating options.
MOUNTING
VARIATIONS
POLARIZING
KEY POSITIONS
Key(s) are located to
right of position(s)
designated. Required
only when polarizing
keys are to be factory
installed
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相關代理商/技術參數 |
參數描述 |
|---|---|
| EB85-P0A1030X | 功能描述:標準卡緣連接器 EB85-PA10GXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產品類型:Contacts 位置/觸點數量:60 安裝角:Straight 電路板厚度: 安裝風格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Copper Alloy 觸點電鍍:Gold |
| EB85-P0A1230X | 功能描述:標準卡緣連接器 EB85-PA12GXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產品類型:Contacts 位置/觸點數量:60 安裝角:Straight 電路板厚度: 安裝風格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Copper Alloy 觸點電鍍:Gold |
| EB85-P0A1530X | 功能描述:標準卡緣連接器 EB85-PA15GXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產品類型:Contacts 位置/觸點數量:60 安裝角:Straight 電路板厚度: 安裝風格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Copper Alloy 觸點電鍍:Gold |
| EB85-P0A1830X | 功能描述:標準卡緣連接器 EB85-PA18GXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產品類型:Contacts 位置/觸點數量:60 安裝角:Straight 電路板厚度: 安裝風格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Copper Alloy 觸點電鍍:Gold |
| EB85-P0A2230X | 功能描述:標準卡緣連接器 EB85-PA22GXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產品類型:Contacts 位置/觸點數量:60 安裝角:Straight 電路板厚度: 安裝風格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點材料:Copper Alloy 觸點電鍍:Gold |
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