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參數(shù)資料
| 型號： | ECCM9KA10-13.2256M |
| 廠商： | ECLIPTEK CORP |
| 元件分類： | 晶體 |
| 英文描述： | QUARTZ CRYSTAL RESONATOR, 13.2256 MHz |
| 封裝： | ROHS COMPLIANT, MINIATURE, CERAMIC PACKAGE-4 |
| 文件頁數(shù)： | 2/2頁 |
| 文件大小： | 163K |
| 代理商： | ECCM9KA10-13.2256M |
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
PARAMETER
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MANUFACTURER
CATEGORY
SERIES
PACKAGE
CLASS
REV
.DATE
ECLIPTEK CORP.
CRYSTAL
ECCM9
CERAMIC
CR56
0
7/08
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
Tolerance = +0.2
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
M
N
O
P
Q
1.5 MIN
50 MIN
20.2 MIN
13±.5
40 MIN
R
S
T
U
V
QTY/REEL
2.5 MIN
10 MIN
22.4 MAX
360 MAX
16.4+2-0
3,000
REEL
A
B
C
D
E
16±.3
7.5±.2
6.75±.2
4 ±.2
2±.2
F
G
H
J
K
L
8±.2
BO*
1.5±.1
AO*
.3 ±.05
KO*
TAPE
*Compliant to EIA-481A
PACKAGING OPTIONS
Blank=Bulk, TR=Tape and Reel
FREQUENCY
PART NUMBERING GUIDE
ECCM9 A A 10 - 32.000M TR
LOAD CAPACITANCE
S=Series Resonant
XX=10pF Parallel Resonant to 50pF Parallel Resonant
MODE OF OPERATION
A=AT-Cut Fundamental
FREQUENCY TOLERANCE/STABILITY
A=±50ppm at 25°C, ±100ppm over 0°C to 70°C
B=±50ppm at 25°C, ±100ppm over -20°C to 70°C
C=±50ppm at 25°C, ±100ppm over -40°C to 85°C
D=±30ppm at 25°C, ±50ppm over 0°C to 70°C
E=±30ppm at 25°C, ±50ppm over -20°C to 70°C
F=±30ppm at 25°C, ±50ppm over -40°C to 85°C
G=±15ppm at 25°C, ±30ppm over 0°C to 70°C
H=±15ppm at 25°C, ±30ppm over -20°C to 70°C
J=±15ppm at 25°C, ±30ppm over -40°C to 85°C
K=±15ppm at 25°C, ±20ppm over 0°C to 70°C
L=±15ppm at 25°C, ±20ppm over -20°C to 70°C
M=±15ppm at 25°C, ±20ppm over -40°C to 85°C
N=±10ppm at 25°C, ±15ppm over 0°C to 70°C
Line 1: E XX.XX
Frequency in MHz
(4 Digits Maximum + Decimal)
Line 2: XXXXX
Ecliptek Manufacturing Identifier
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
3
2
1
4
MARKING
ORIENT
A
TION
2
3
4
1
3.2
±0.2
5.0
±0.2
1.0
MAX
2.6
±0.1
1.4 ±0.1
1.2 ±0.1 (X4)
0.9 ±0.1
(X4)
Note: Chamfer not shown.
Pad 1: Crystal Pad 2: Cover/Ground
Pad 3: Crystal Pad 4: Cover/Ground
SPECIFICATION
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
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