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參數(shù)資料
| 型號(hào)： | EFM32G200F16 |
| 廠商： | Energy Micro |
| 文件頁數(shù)： | 58/64頁 |
| 文件大小： | 0K |
| 描述： | MCU 32BIT 16KB FLASH 32-QFN |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 系列： | Gecko |
| 核心處理器： | ARM? Cortex?-M3 |
| 芯體尺寸： | 32-位 |
| 速度： | 32MHz |
| 連通性： | EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測/復(fù)位，DMA，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 24 |
| 程序存儲(chǔ)器容量： | 16KB（16K x 8） |
| 程序存儲(chǔ)器類型： | 閃存 |
| RAM 容量： | 8K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.8 V ~ 3.8 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 4x12b，D/A 1x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 32-VQFN 裸露焊盤 |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | EFM32G200F16-QFN32 |
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...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G200FXX - d0003_Rev1.60
61
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32G200 Memory Map with largest RAM and Flash sizes .......................................................................... 7
28MHz ..................................................................................................................................................... 11
21MHz ..................................................................................................................................................... 11
14MHz ..................................................................................................................................................... 12
11MHz ..................................................................................................................................................... 12
7MHz ....................................................................................................................................................... 13
3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 28MHz ............................... 13
3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 21MHz ............................... 14
3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 14MHz ............................... 14
3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 11MHz ............................... 15
3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 7MHz ............................... 15
3.11. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO. ............................................................. 16
3.12. EM3 current consumption. ................................................................................................................... 16
3.13. EM4 current consumption. ................................................................................................................... 17
3.14. Typical Low-Level Output Current, 2V Supply Voltage ................................................................................ 20
3.15. Typical High-Level Output Current, 2V Supply Voltage ................................................................................ 21
3.16. Typical Low-Level Output Current, 3V Supply Voltage ................................................................................ 22
3.17. Typical High-Level Output Current, 3V Supply Voltage ................................................................................ 23
3.18. Typical Low-Level Output Current, 3.8V Supply Voltage .............................................................................. 24
3.19. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................. 25
3.20. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 28
3.21. Calibrated HFRCO 11 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 30
3.22. Calibrated HFRCO 14 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 30
3.23. Calibrated HFRCO 21 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 30
3.24. Calibrated HFRCO 28 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.25. Integral Non-Linearity (INL) ................................................................................................................... 35
3.26. Differential Non-Linearity (DNL) .............................................................................................................. 36
3.27. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 37
3.28. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 38
3.29. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 39
3.30. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 40
3.31. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 40
3.32. Typical ACMP Characteristics ............................................................................................................... 43
4.1. EFM32G200 Pinout (top view, not to scale) ............................................................................................... 46
4.2. QFN32 ................................................................................................................................................ 50
5.1. QFN32 PCB Land Pattern ...................................................................................................................... 51
5.2. QFN32 PCB Solder Mask ....................................................................................................................... 52
5.3. QFN32 PCB Stencil Design .................................................................................................................... 53
6.1. Example Chip Marking ........................................................................................................................... 54
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EFM32G200F16G-E-QFN32R | 功能描述:16K FLASH, 8K RAM, NO AES 制造商:silicon labs 系列:Gecko 包裝:剪切帶（CT） 零件狀態(tài):在售 核心處理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:32MHz 連接性:I2C，IrDA，智能卡，SPI，UART/USART 外設(shè):欠壓檢測/復(fù)位，DMA，POR，PWM，WDT I/O 數(shù):24 程序存儲(chǔ)容量:16KB（16K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 容量:- RAM 容量:8K x 8 電壓 - 電源（Vcc/Vdd）:1.98 V ~ 3.8 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 4x12b，D/A 1x12b 振蕩器類型:內(nèi)部 工作溫度:-40°C ~ 85°C（TA） 封裝/外殼:32-VQFN 裸露焊盤 供應(yīng)商器件封裝:32-QFN（6x6） 標(biāo)準(zhǔn)包裝:1 |
| EFM32G200F16-QFN32 | 制造商:Energy Micro AS 功能描述:MCU, 16K FLASH, USART+UART 2, QFN32 - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 16KB FLASH 32QFN |
| EFM32G200F16-QFN32T | 制造商:Energy Micro AS 功能描述:MCU, 16K FLASH, USART+UART 2, QFN32 - Trays 制造商:Energy Micro 功能描述:energy micro EFM32G200F16-QFN32T Microcontrollers (MCU) |
| EFM32G200F16-QFN32-T | 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 16KB FLASH 32QFN |
| EFM32G200F16-T | 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 16KB FLASH 32QFN |
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