參數(shù)資料
型號: EFM32G222F64
廠商: Energy Micro
文件頁數(shù): 48/65頁
文件大小: 0K
描述: IC MCU 32BIT 64KB FLASH QFP48
標(biāo)準(zhǔn)包裝: 1,000
系列: Gecko
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 32MHz
連通性: I²C,IrDA,智能卡,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 37
程序存儲器容量: 64KB(64K x 8)
程序存儲器類型: 閃存
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 4x12b,D/A 1x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 48-TQFP
包裝: 帶卷 (TR)
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G222FXX - d0033_Rev1.60
52
www.energymicro.com
4.4 TQFP48 Package
Figure 4.2. TQFP48
Note:
1. Dimensions and tolerance per ASME Y14.5M-1994
2. Control dimension: Millimeter.
3. Datum plane AB is located at bottom of lead and is coincident with the lead where the lead exists
from the plastic body at the bottom of the parting line.
4. Datums T, U and Z to be determined at datum plane AB.
5. Dimensions S and V to be determined at seating plane AC.
6. Dimensions A and B do not include mold protrusion. Allowable protrusion is 0.250 per side. Dimen-
sions A and B do include mold mismatch and are determined at datum AB.
7. Dimension D does not include dambar protrusion. Dambar protrusion shall not cause the D dimension
to exceed 0.350.
8. Minimum solder plate thickness shall be 0.0076.
9. Exact shape of each corner is optional.
Table 4.4. QFP48 (Dimensions in mm)
DIM
MIN
NOM
MAX
DIM
MIN
NOM
MAX
A
-
7.000 BSC
-
M
-
12DEG REF
-
A1
-
3.500 BSC
-
N
0.090
-
0.160
B
-
7.000 BSC
-
P
-
0.250 BSC
-
B1
-
3.500 BSC
-
R
0.150
-
0.250
C
1.000
-
1.200
S
-
9.000 BSC
-
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