參數(shù)資料
型號： EFM32G890F64
廠商： Energy Micro
文件頁數(shù)： 66/71頁
文件大小： 0K
描述： MCU 32BIT 64KB FLASH 112-BGA
標(biāo)準(zhǔn)包裝： 1,000
系列： Gecko
核心處理器： ARM? Cortex?-M3
芯體尺寸： 32-位
速度： 32MHz
連通性： EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART
外圍設(shè)備： 欠壓檢測/復(fù)位，DMA，LCD，POR，PWM，WDT
輸入/輸出數(shù)： 90
程序存儲器容量： 64KB（64K x 8）
程序存儲器類型： 閃存
RAM 容量： 16K x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b，D/A 2x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 112-LFBGA
包裝： 帶卷 (TR)
其它名稱： EFM32G890F64-BGA112
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G890FXX - d0010_Rev1.60
69
www.energymicro.com
List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 7
3.1. Absolute Maximum Ratings ...................................................................................................................... 9
3.2. General Operating Conditions ................................................................................................................... 9
3.3. Environmental ....................................................................................................................................... 10
3.4. Current Consumption ............................................................................................................................. 11
3.5. Energy Modes Transitions ...................................................................................................................... 18
3.6. Power Management ............................................................................................................................... 19
3.7. Flash .................................................................................................................................................. 19
3.8. GPIO .................................................................................................................................................. 20
3.9. LFXO .................................................................................................................................................. 27
3.10. HFXO ................................................................................................................................................ 28
3.11. LFRCO .............................................................................................................................................. 28
3.12. HFRCO ............................................................................................................................................. 30
3.13. ULFRCO ............................................................................................................................................ 32
3.14. ADC .................................................................................................................................................. 32
3.15. DAC .................................................................................................................................................. 41
3.16. ACMP ............................................................................................................................................... 43
3.17. VCMP ............................................................................................................................................... 45
3.18. LCD .................................................................................................................................................. 46
3.19. Digital Peripherals ............................................................................................................................... 46
4.1. Device Pinout ....................................................................................................................................... 48
4.2. Alternate functionality overview ................................................................................................................ 52
4.3. GPIO Pinout ........................................................................................................................................ 56
5.1. BGA112 PCB Land Pattern Dimensions (Dimensions in mm) ......................................................................... 58
5.2. BGA112 PCB Solder Mask Dimensions (Dimensions in mm) ......................................................................... 59
5.3. BGA112 PCB Stencil Design Dimensions (Dimensions in mm) ....................................................................... 60
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EFM32G890F64-BGA112 制造商:Energy Micro AS 功能描述:MCU, 64K FLASH, LCD 4X40, USART+UART 3+1, BGA112 - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 112BGA
EFM32G890F64-BGA112T 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GECKO - Trays
EFM32G890F64-BGA112-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 112BGA
EFM32G890F64-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 112BGA
EFM32-G890-SK-F128 制造商:Energy Micro AS 功能描述:MCU CORTEX-M3 EFM32-G890 SAMPLE-PK 制造商:Energy Micro AS 功能描述:MCU, CORTEX-M3, EFM32-G890 SAMPLE-PK 制造商:Silicon Laboratories Inc 功能描述:MCU, CORTEX-M3, EFM32-G890 SAMPLE-PK
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