參數(shù)資料
型號： EFM32GG990F1024
廠商： Energy Micro
文件頁數(shù)： 68/73頁
文件大?。?/td> 0K
描述： IC MCU 32BIT 1024KB FLASH BGA112
標(biāo)準(zhǔn)包裝： 1
系列： Giant Gecko
核心處理器： ARM? Cortex?-M3
芯體尺寸： 32-位
速度： 48MHz
連通性： EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART，USB
外圍設(shè)備： 欠壓檢測/復(fù)位，DMA，LCD，POR，PWM，WDT
輸入/輸出數(shù)： 87
程序存儲器容量： 1MB（1M x 8）
程序存儲器類型： 閃存
RAM 容量： 128K x 8
電壓 - 電源 (Vcc/Vdd)： 1.85 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b，D/A 2x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 112-LFBGA
包裝： 標(biāo)準(zhǔn)包裝
其它名稱： 914-1051-6
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32GG990FXX - d0046_Rev1.10
70
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32GG990 Memory Map with largest RAM and Flash sizes ........................................................................ 9
3.1. Typical Low-Level Output Current, 2V Supply Voltage .................................................................................. 16
3.2. Typical High-Level Output Current, 2V Supply Voltage ................................................................................. 17
3.3. Typical Low-Level Output Current, 3V Supply Voltage .................................................................................. 18
3.4. Typical High-Level Output Current, 3V Supply Voltage ................................................................................. 19
3.5. Typical Low-Level Output Current, 3.8V Supply Voltage ............................................................................... 20
3.6. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................... 21
3.7. Calibrated LFRCO Frequency vs Temperature and Supply Voltage ................................................................ 23
3.12. Integral Non-Linearity (INL) ................................................................................................................... 30
3.13. Differential Non-Linearity (DNL) .............................................................................................................. 31
3.14. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 32
3.15. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 33
3.16. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 34
3.17. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 35
3.19. ADC Temperature sensor readout ......................................................................................................... 36
3.20. OPAMP Common Mode Rejection Ratio ................................................................................................. 39
3.21. OPAMP Positive Power Supply Rejection Ratio ........................................................................................ 39
3.22. OPAMP Negative Power Supply Rejection Ratio ...................................................................................... 40
3.23. OPAMP Voltage Noise Spectral Density (Unity Gain) Vout=1V ..................................................................... 40
3.24. OPAMP Voltage Noise Spectral Density (Non-Unity Gain) .......................................................................... 40
3.25. Typical ACMP Characteristics ............................................................................................................... 42
4.1. EFM32GG990 Pinout (top view, not to scale) ............................................................................................. 46
4.2. Opamp Pinout ...................................................................................................................................... 59
4.3. BGA112 .............................................................................................................................................. 59
5.1. BGA112 PCB Land Pattern ..................................................................................................................... 61
5.2. BGA112 PCB Solder Mask ..................................................................................................................... 62
5.3. BGA112 PCB Stencil Design ................................................................................................................... 63
6.1. Example Chip Marking ........................................................................................................................... 64
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EFM32GG990F1024-BGA112 制造商:Energy Micro AS 功能描述:GIANT GECKO MCU - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 1MB FLASH 112BGA
EFM32GG990F1024-BGA112T 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GIANT GECKO - Trays
EFM32GG990F1024-BGA112-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 1MB FLASH 112BGA
EFM32GG990F1024G-E-BGA112R 功能描述:IC MCU 32BIT 1MB FLASH 112BGA 制造商:silicon labs 系列:Giant Gecko 包裝:剪切帶（CT） 零件狀態(tài):在售 核心處理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:48MHz 連接性:EBI/EMI，I2C，IrDA，智能卡，SPI，UART/USART，USB 外設(shè):欠壓檢測/復(fù)位，DMA，LCD，POR，PWM，WDT I/O 數(shù):87 程序存儲容量:1MB（1M x 8） 程序存儲器類型:閃存 EEPROM 容量:- RAM 容量:128K x 8 電壓 - 電源（Vcc/Vdd）:1.98 V ~ 3.8 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x12b，D/A 2x12b 振蕩器類型:內(nèi)部 工作溫度:-40°C ~ 85°C（TA） 封裝/外殼:112-LFBGA 供應(yīng)商器件封裝:112-BGA（10x10） 標(biāo)準(zhǔn)包裝:1
EFM32-GG990F1024-SK 制造商:Energy Micro AS 功能描述:GIANT GECKO SAMPLE KIT - Bulk
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