參數(shù)資料
型號: EFM32LG295F64
廠商: Energy Micro
文件頁數(shù): 64/69頁
文件大小: 0K
描述: IC MCU 32BIT 64KB FLASH BGA120
標(biāo)準(zhǔn)包裝: 1,000
系列: Leopard Gecko
核心處理器: ARM? Cortex?-M4
芯體尺寸: 32-位
速度: 48MHz
連通性: EBI/EMI,I²C,IrDA,智能卡,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 93
程序存儲器容量: 64KB(64K x 8)
程序存儲器類型: 閃存
RAM 容量: 32K x 8
電壓 - 電源 (Vcc/Vdd): 1.85 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b,D/A 2x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 120-VFBGA
包裝: 帶卷 (TR)
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32LG295FXX - d0109_Rev1.10
67
www.energymicro.com
List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 7
3.1. Absolute Maximum Ratings ..................................................................................................................... 10
3.2. General Operating Conditions .................................................................................................................. 10
3.3. Environmental ....................................................................................................................................... 11
3.4. Current Consumption ............................................................................................................................. 12
3.5. Energy Modes Transitions ...................................................................................................................... 13
3.6. Power Management ............................................................................................................................... 13
3.7. Flash .................................................................................................................................................. 14
3.8. GPIO .................................................................................................................................................. 15
3.9. LFXO .................................................................................................................................................. 22
3.10. HFXO ................................................................................................................................................ 22
3.11. LFRCO .............................................................................................................................................. 23
3.12. HFRCO ............................................................................................................................................. 24
3.13. ULFRCO ............................................................................................................................................ 26
3.14. ADC .................................................................................................................................................. 26
3.15. DAC .................................................................................................................................................. 36
3.16. OPAMP ............................................................................................................................................. 37
3.17. ACMP ............................................................................................................................................... 41
3.18. VCMP ............................................................................................................................................... 43
3.19. Digital Peripherals ............................................................................................................................... 43
4.1. Device Pinout ....................................................................................................................................... 45
4.2. Alternate functionality overview ................................................................................................................ 50
4.3. GPIO Pinout ........................................................................................................................................ 55
5.1. BGA120 PCB Land Pattern Dimensions (Dimensions in mm) ......................................................................... 58
5.2. BGA120 PCB Solder Mask Dimensions (Dimensions in mm) ......................................................................... 59
5.3. BGA120 PCB Stencil Design Dimensions (Dimensions in mm) ....................................................................... 60
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