參數(shù)資料
型號: EL1505C
英文描述: Differential Line Driver(差分線驅(qū)動器)
中文描述: 差分線路驅(qū)動器(差分線驅(qū)動器)
文件頁數(shù): 3/13頁
文件大小: 209K
代理商: EL1505C
11
EL1504C, EL1505C
Differential Line Driver
EL
1504C,
EL1505
C
This plot summarizes the note’s results:
The
θ
JA for the EL1505C is fixed at 95°C/W and so the
applications of the EL1505C are limited to the lower
supply voltages and higher loads.
EL1504C PCB Design
The 20-lead SO Power Package (EL1504C) is designed
so that heat may be conducted away from the device in
an efficient manner. To disperse this heat, the center four
leads on either side of the package are internally fused to
the mounting platform of the die. Heat flows through the
leads into the circuit board copper, then spreads and con-
vects to air. Thus, the ground plane on the component
side of the board becomes the heatsink. This has proven
to be a very effective technique, but several aspects of
board layout should be noted. First, the heat should not
be shunted to internal copper layers of the board nor
backside foil, since the feedthroughs and fiberglass of
the board are not very thermally conductive. To obtain
the best thermal resistance of the mounted part,
θ
JM, the
topside copper ground plane should have as much area
as possible and be as thick as practical. If possible, the
solder mask should be cut away from the EL1504C to
improve thermal resistance. Finally, metal heatsinks can
be placed against the board close to the part to draw heat
toward the chassis.
EL1505C Considerations
Because the EL1505C package does not have any spe-
cial method for conducting heat away from the package,
care must be taken to ensure that the maximum dissipa-
tion is not exceeded. The ambient temperature in the
enviroment in which the device is to be used, the supply
voltage and the desired output current to drive the
required load all must be taken into account. The table
below shows some possible configurations.
For loads other than the ones mentioned above, the asso-
ciated graphs in the previous sections can be used to
determine the required copper board area and whether a
load is feasible or not.
Output Loading
While the drive amplifiers can output in excess of 250
mA, the internal metallization is not designed to carry
more than 75 mA of steady DC current and there is no
current-limit mechanism. This allows safely driving
peak sinusoidal currents of
π x 75 mA, or 236 mA. This
current is more than that required to drive line imped-
ances to large output levels, but output short circuits
cannot be tolerated. The series output resistor will usu-
ally limit currents to safe values in the event of line
shorts. Driving lines with no series resistor is a serious
hazard.
The amplifiers are sensitive to capacitive loading. More
than 25 pF will cause peaking of the frequency response.
The same is true of badly terminated lines connected
without a series matching resistor.
Thermal Resistance of EL1504C vs Copper Area
Possible Load Configurations
VS
Diff
VOUT
(Peak)
Diff
RLOAD
IOUT
(Peak)
POUT
(Peak)
PDISS
(RMS)
±5V
5V
50
100mA
500mW
629mW
±5V
6.5V
100
65mA
423mW
517mW
±5V
6.8V
150
45mA
308mW
464mW
±5V
6.8V
200
34mA
231mW
436mW
±6V or +12V
5.99V
50
120mA
718mW
821mW
±6V or +12V
7.88V
100
79mA
620mW
662mW
±6V or +12V
8.8V
150
59mA
516mW
592mW
±6V or +12V
8.8V
200
44mA
387mW
549mW
±15V
20.21V
100
202mA
4.084W
2.586W
±15V
22.58V
150
151mA
3.398W
2.141W
±15V
23.98V
200
120mA
2.876W
1.895W
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