參數(shù)資料
型號: EL1508CL-T13
廠商: Intersil
文件頁數(shù): 7/18頁
文件大?。?/td> 0K
描述: IC LINE DRIVER ADSL 24-QFN
標準包裝: 2,500
類型: 驅(qū)動器
驅(qū)動器/接收器數(shù): 1/0
電源電壓: 5 V ~ 12 V
安裝類型: 表面貼裝
封裝/外殼: 24-VFQFN 裸露焊盤
供應商設備封裝: 24-QFN(5x4)
包裝: 帶卷 (TR)
15
FN7014.5
March 26, 2007
EL1508CM PCB Layout Considerations
The 20 Ld SOIC (0.300") Power Package is designed so that
heat may be conducted away from the device in an efficient
manner. To disperse this heat, the center four leads on either
side of the package are internally fused to the mounting
platform of the die. Heat flows through the leads into the
circuit board copper, then spreads and convects to air. Thus,
the ground plane on the component side of the board
becomes the heatsink. This has proven to be a very effective
technique, but several aspects of board layout should be
noted. First, the heat should not be shunted to internal
copper layers of the board nor backside foil, since the
feedthroughs and fiberglass of the board are not very
thermally conductive. To obtain the best thermal resistance
of the mounted part,
θJA, the topside copper ground plane
should have as much area as possible and be as thick as
practical. If possible, the solder mask should be cut away
from the EL1508 to improve thermal resistance. Finally,
metal heatsinks can be placed against the board close to the
part to draw heat toward the chassis. The graph below
shows various
θJAs for the 20 Ld SOIC mounted on different
copper foil areas.
Power Control Function
The EL1508 contains two forms of power control operation.
Two digital inputs, C0 and C1, can be used to control the
supply current of the EL1508 drive amplifiers. As the supply
current is reduced, the EL1508 will start to exhibit slightly
higher levels of distortion and the frequency response will be
limited. The 4 power modes of the EL1508 are set up as
shown in the following table:
Another method for controlling the power consumption of the
EL1508 is to connect a resistor from the IADJ pin to ground.
When the IADJ pin is grounded (the normal state), the supply
current per channel is as per the specifications table on page
2. When a resistor is inserted, the supply current is scaled
according to the “RSET vs IS” graphs in the Performance
Curves section.
Both methods of power control can be used simultaneously.
In this case, positive and negative supply currents (per amp)
are given by the equations below:
Output Loading
While the drive amplifiers can output in excess of 500mA
transiently, the internal metallization is not designed to carry
more than 100mA of steady DC current and there is no
TOP (16 Ld SO)
INTERNAL GROUND PLANE (16 Ld SO)
TABLE 1. POWER MODES OF THE EL1508
C1
C0
OPERATION
00
IS full power mode
0
1
2/3 IS power mode
1
0
1/3 IS power mode
1
Power-down
FIGURE 45. THERMAL RESISTANCE of 20 LD SO (0.300")
EL1508 vs BOARD COPPER AREA
02
10
68
4
55
50
45
40
35
30
AREA OF CIRCUIT BOARD HEAT SINK (in2)
MOUNT
E
D
DEV
ICE
θ JA
(°C/
W)
Note: 2OZ COPPER USED
TOP FOIL-WITH 0.45in2
BOTTOM FOIL WITH MANY
FEEDTHROUGHS
TOP FOIL ONLY-NO SOLDER MASK
TOP FOIL ONLY-WITH SOLDER MASK
I
S+0.9mA
12.4mA
1R
SET
1574
Ω
÷
+
()
------------------------------------------------------
2/3C
1
1/3C
0
+
()
×
+
=
I
S-
12.4mA
1R
SET
1574
Ω
÷
+
()
------------------------------------------------------
2/3C
1
(
1/3C
0 )
+
×
=
EL1508
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