12
FN7328.2
May 3, 2007
FIGURE 39. 0.1% SETTLING TIME vs TEMPERATURE
FIGURE 40. VOS vs TEMPERATURE
FIGURE 41. IBIAS CURRENT vs TEMPERATURE
FIGURE 42. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 43. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Typical Performance Curves (Continued)
-40
150
0
120
30
26
22
18
14
10
DIE TEMPERATURE (°C)
SETTLI
NG
TIME
(ns)
40
80
140
-20
20
60
100
VS = ±6V
50mVOPP
-40
150
0
120
0
-50
-150
-300
-350
-400
DIE TEMPERATURE (°C)
V
OS
(V)
40
80
140
-20
20
60
100
-100
-200
-250
-40
150
0
120
8
6
5
4
DIE TEMPERATURE (°C)
I BIAS
(A)
40
80
140
-20
20
60
100
7
607mW
θJA = 206°C/W
MSOP8/10
781mW
θJA = 160°C/W
SO8
1.2
1
0.8
0.6
0.2
0
25
50
75
100
150
AMBIENT TEMPERATURE (°C)
P
O
WER
DIS
S
IPATION
(W)
125
85
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.4
1.087W
θJA = 115°C/W
MSOP8/10
1.136W
θ
JA = 110°C/W
SO8
1.8
1.6
1.4
0.8
0.6
0.2
0
P
O
WER
DI
SSI
PATIO
N
(W
)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.4
1
1.2
0
25
50
75
100
150
AMBIENT TEMPERATURE (°C)
125
85
EL1516, EL1516A