10
FN7008.2
May 3, 2007
application does not come at the expense of stability. As
seen in the typical performance curves, the EL2228 in a gain
of only 1 exhibited 0.5dB of peaking with a 500
Ω load.
Output Drive Capability
The EL2228 is designed to drive a low impedance load. It
can easily drive 6VP-P signal into a 500Ω load. This high
output drive capability makes the EL2228 an ideal choice for
RF, IF, and video applications. Furthermore, the EL2228 is
current-limited at the output, allowing it to withstand
momentary short to ground. However, the power dissipation
with output-shorted cannot exceed the power dissipation
capability of the package.
Driving Cables and Capacitive Loads
Although the EL2228 is designed to drive low impedance
load, capacitive loads will decreases the amplifier's phase
margin. As shown in the performance curves, capacitive
load can result in peaking, overshoot and possible
oscillation. For optimum AC performance, capacitive loads
should be reduced as much as possible or isolated with a
series resistor between 5
Ω to 20Ω. When driving coaxial
cables, double termination is always recommended for
reflection-free performance. When properly terminated, the
capacitance of the coaxial cable will not add to the capacitive
load seen by the amplifier.
Power Dissipation
With the wide power supply range and large output drive
capability of the EL2228, it is possible to exceed the 150°C
maximum junction temperatures under certain load and
power-supply conditions. It is therefore important to calculate
the maximum junction temperature (TJMAX) for all
applications to determine if power supply voltages, load
conditions, or package type need to be modified for the
EL2228 to remain in the safe operating area. These
parameters are related as follows:
T
JMAX
T
MAX
θ
JAxPDMAXTOTAL
()
+
=
where:
PDMAXTOTAL is the sum of the maximum power
dissipation of each amplifier in the package (PDMAX)
PDMAX for each amplifier can be calculated as follows:
PD
MAX
2*V
S
I
SMAX
V
S
(
- V
OUTMAX )
V
OUTMAX
R
L
----------------------------
×
+
×
=
where:
TMAX = Maximum ambient temperature
θ
JA = Thermal resistance of the package
PDMAX = Maximum power dissipation of 1 amplifier
VS = Supply voltage
IMAX = Maximum supply current of 1 amplifier
VOUTMAX = Maximum output voltage swing of the
application
RL = Load resistance
Power Supply Bypassing And Printed Circuit
Board Layout
As with any high frequency devices, good printed circuit
board layout is essential for optimum performance. Ground
plane construction is highly recommended. Pin lengths
should be kept as short as possible. The power supply pins
must be closely bypassed to reduce the risk of oscillation.
The combination of a 4.7F tantalum capacitor in parallel
with 0.1F ceramic capacitor has been proven to work well
when placed at each supply pin. For single supply operation,
where pin 4 (VS-) is connected to the ground plane, a single
4.7F tantalum capacitor in parallel with a 0.1F ceramic
capacitor across pin 8 (VS+).
For good AC performance, parasitic capacitance should be
kept to a minimum. Ground plane construction again should
be used. Small chip resistors are recommended to minimize
series inductance. Use of sockets should be avoided since
they add parasitic inductance and capacitance which will
result in additional peaking and overshoot.
EL2228