14
FN7177.2
March 31, 2011
FIGURE 45. MAXIMUM POWER DISSIPATION vs AMBIENT
TEMPERATURE SINGLES (TJMAX = +150°C)
FIGURE 46. MAXIMUM POWER DISSIPATION vs AMBIENT
TEMPERATURE DUALS (TJMAX = +150°C)
FIGURE 47. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE QUADS (TJMAX = +150°C)
Typical Performance Curves
POWE
R
DI
SSI
PATI
ON
(W)
AMBIENT TEMPERATURE (°C)
0
0.4
0.8
1.2
2.0
1.6
-50
10
40
70
-20
100
PDIP, ΘJA = 110°C/W
SOIC, ΘJA = 161°C/W
SOT23-5, ΘJA = 256°C/W
POWE
R
DI
SSI
PATI
ON
(W)
AMBIENT TEMPERATURE (°C)
0
0.5
1.0
1.5
2.5
2.0
-50
104070
-20
100
PDIP-14, ΘJA = 87°C/W
SOIC-14, ΘJA = 120°C/W
PDIP-8, ΘJA = 107°C/W
MSOP-8,10, ΘJA = 206°C/W
SOIC-8, ΘJA = 159°C/W
POWER
DISS
IP
A
T
ION
(W)
AMBIENT TEMPERATURE (°C)
0
0.5
1.0
1.5
2.5
2.0
-50
10
40
70
-20
100
SOIC-14, ΘJA = 118°C/W
QSOP-16, ΘJA = 158°C/W
PDIP-14, ΘJA = 83°C/W
EL5144, EL5146, EL5244, EL5246, EL5444