EL5211T
15
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FN6893.0
May 12, 2010
HMSOP (Heat-Sink MSOP) Package Family
1
(N/2)
(N/2)+1
N
PLANE
SEATING
N LEADS
0.10 C
PIN #1
I.D.
E1
E
b
DETAIL X
3° ±3°
GAUGE
PLANE
SEE DETAIL "X"
c
A
0.25
A2
A1
L
0.25
C A B
D
A
M
B
e
C
0.08
C A B
M
H
L1
END VIEW
SIDE VIEW
TOP VIEW
E2
BOTTOM VIEW
D1
EXPOSED
THERMAL PAD
MDP0050
HMSOP (HEAT-SINK MSOP) PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLERANCE
NOTES
HMSOP8 HMSOP10
A
1.00
Max.
-
A1
0.075
+0.025/-0.050
-
A2
0.86
±0.09
-
b
0.30
0.20
+0.07/-0.08
-
c
0.15
±0.05
-
D
3.00
±0.10
1, 3
D1
1.85
Reference
-
E
4.90
±0.15
-
E1
3.00
±0.10
2, 3
E2
1.73
Reference
-
e
0.65
0.50
Basic
-
L
0.55
±0.15
-
L1
0.95
Basic
-
N
8
10
Reference
-
Rev. 1 2/07
NOTES:
1. Plastic or metal protrusions of 0.15mm maximum per side are not
included.
2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.