EL5220T
13
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FN6892.0
May 4, 2010
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5220T can provide gain at high frequency, so
good printed circuit board layout is necessary for
optimum performance. Ground plane construction is
highly recommended, trace lengths should be as short
as possible and the power supply pins must be well
bypassed to reduce any risk of oscillation.
For normal single supply operation (the VS- pin is
connected to ground) a 4.7μF capacitor should be
placed from VS+ to ground, then a parallel 0.1μF
capacitor should be connected as close to the amplifier
as possible. One 4.7μF capacitor may be used for
multiple devices. For dual supply operation the same
capacitor combination should be placed at each supply
pin to ground.
It is highly recommended that EL5220T exposed
thermal pad packages should always have the pad
connected to the lowest potential, VS-, to optimize
thermal and operating performance. PCB vias should
be placed below the device’s exposed thermal pad to
transfer heat to the VS- plane and away from the
device.
Products
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Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com:
EL5220TRevision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
CHANGE
5/4/10
FN6892.0
Initial Release