參數(shù)資料
型號(hào): EL6206CW-T7A
廠商: INTERSIL CORP
元件分類: 其它接口
英文描述: Laser Driver Oscillator
中文描述: SPECIALTY INTERFACE CIRCUIT, PDSO5
封裝: SOT-23, 5 PIN
文件頁(yè)數(shù): 6/7頁(yè)
文件大?。?/td> 136K
代理商: EL6206CW-T7A
6
Supply Bypassing and Grounding
The resistance of bypass-capacitors and the inductance of
bonding wires prevent perfect bypass action, and 150mV
P-P
noise on the power lines is common. There needs to be a
lossy bead inductance and secondary bypass on the supply
side to control signals from propagating down the wires.
Figure 2 shows the typical connection.
Also important is circuit-board layout. At the EL6206's
operating frequencies, even the ground plane is not low-
impedance. High frequency current will create voltage drops
in the ground plane. Figure 3 shows the output current loops.
For the pushing current loop, the current flows through the
bypass capacitor, into the EL6206 supply pin, out the I
OUT
pin to the laser, and from the laser back to the decoupling
capacitor. This loop should be small.
For the pulling current loop, the current flows into the I
OUT
pin, out of the ground pin, to the laser cathode, and from the
laser diode back to the I
OUT
pin. This loop should also be
small.
Power Dissipation
With the high output drive capability, the EL6206 is possible
to exceed the 125°C “absolute-maximum junction
temperature” under certain conditions. Therefore, it is
important to calculate the maximum junction temperature for
the application to determine if the conditions need to be
modified for the oscillator to remain in the safe operating
area.
The maximum power dissipation allowed in a package is
determined according to:
where
P
DMAX
= Maximum Power Dissipation in the Package
T
JMAX
= Maximum Junction Temperature
T
AMAX
= Maximum Ambient Temperature
θ
JA
= Thermal Resistance of the Package
The supply current of the EL6206 depends on the peak-to-
peak output current and the operating frequency which are
determined by resistors R
AMP
and R
FREQ
. The supply
current can be predicted approximately by the following
equation:
The power dissipation can be calculated from the following
equation:
Here, V
SUP
is the supply voltage. Figures 4 and 5 provide a
convenient way to see if the device will overheat. The
maximum safe power dissipation can be found graphically,
based on the package type and the ambient temperature. By
using the previous equation, it is a simple matter to see if P
D
exceeds the device's power derating curve. To ensure proper
operation, it is important to observe the recommended
derating curve shown in Figures 4 and 5. A flex circuit may
have a higher
θ
JA
, and lower power dissipation would then
be required.
FIGURE 2. RECOMMENDED SUPPLY BYPASSING
+5V
V
S
L Series: 70
reactance at 300MHz
0.1μF
Chip
EL6206
GND
0.1μF
Chip
FIGURE 3. OUTPUT CURRENT LOOPS
SINKING CURRENT LOOP
SOURCING CURRENT LOOP
SUPPLY
BYPASS
LASER
DIODE
R
FREQ
R
AMP
GND
P
DMAX
T
--------------------------------------------
T
JA
=
I
SUP
------------------------------------------
AMP
FREQ
----------------------------------
0.6mA
+
+
=
P
D
V
SUP
I
SUP
×
=
FIGURE 4. PACKAGE POWER DISSIPATION VS AMBIENT
TEMPERATURE
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (°C)
P
85
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
488mW
5PnSOT23
θ
JA
=256°CW
EL6206
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