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參數(shù)資料
| 型號(hào)： | EL7566DRE-T13 |
| 廠商： | INTERSIL CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | Monolithic 6 Amp DC-DC Step-Down Regulator |
| 中文描述： | 7.8 A SWITCHING REGULATOR, 1000 kHz SWITCHING FREQ-MAX, PDSO28 |
| 封裝： | MO-153, HTSSOP-28 |
| 文件頁數(shù)： | 13/14頁 |
| 文件大小： | 490K |
| 代理商： | EL7566DRE-T13 |
13
FN7102.5
December 1, 2004
For convenience, Table 3 lists the compensation values for
frequently used output voltages.
Thermal Management
The EL7566 is packaged in a thermally-efficient HTSSOP-28
package, which utilizes the exposed thermal pad at the
bottom to spread heat through PCB metal.
Therefore:
1. The thermal pad must be soldered to the PCB.
2. Maximize the PCB area.
3. If a multiple layer PCB is used, thermal vias (13 to 25 mil)
must be placed underneath the thermal pad to connect to
ground plane(s). Do not place thermal reliefs on the vias.
Figure 25 shows a typical connection.
The thermal resistance for this package is as low as 26°C/W
for 2 layer PCB of 0.39" thickness (See Figure 9). The actual
junction temperature can be measured at V
TJ
pin.
The thermal performance of the IC is heavily dependent on
the layout of the PCB. The user should exercise care during
the design phase to ensure the IC will operate within the
recommended environmental conditions.
Layout Considerations
The layout is very important for the converter to function
properly. Follow these tips for best performance:
1. Separate the Power Ground (
connect them only at one point right at the SGND pin
2. Place the input capacitor(s) as close to V
IN
and PGND
pins as possible
3. Make as small as possible the loop from LX pins to L to
C
O
to PGND pins
4. Place R
1
and R
2
pins as close to the FB pin as possible
5. Maximize the copper area around the PGND pins; do not
place thermal relief around them
6. Thermal pad should be soldered to PCB. Place several
via holes under the chip to the ground plane to help heat
dissipation
The demo board is a good example of layout based on this
outline. Please refer to the EL7566 Application Brief.
) and Signal Ground (
);
TABLE 3. COMPENSATION VALUES
V
O
(V)
R
C
(K
)
C
C
(PF)
3.3
13.7
8200
2.5
10.5
8200
1.8
7.68
8200
1.5
6.49
8200
1.2
5.23
8200
1
4.42
8200
0.8
3.57
8200
GROUND PLANE
CONNECTION
COMPONENT SIDE
CONNECTION
FIGURE 25. PCB LAYOUT - 28-PIN HTSSOP PACKAGE
EL7566
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| EL7566DRE-T7 | Monolithic 6 Amp DC-DC Step-Down Regulator |
| EL7566DREZ | Monolithic 6 Amp DC-DC Step-Down Regulator |
| EL7566DREZ-T7 | EB Melody & Chime Series; Mounting Style: Panel mount; Functions: Alarm; Rated Voltage: 120V AC; Style: Box style; Color: Beige Enclosure; Diameter: 133mm square; Applicable Model: EB |
| EL7566 | Monolithic 6 Amp DC-DC Step-Down Regulator |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EL7566DRE-T7 | 功能描述:IC REG BUCK SYNC ADJ 6A 28HTSSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:降壓（降壓） 輸出類型:固定 輸出數(shù):1 輸出電壓:3.3V 輸入電壓:4.5 V ~ 24 V PWM 型:- 頻率 - 開關(guān):- 電流 - 輸出:125mA 同步整流器:無 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 包裝:Digi-Reel® 供應(yīng)商設(shè)備封裝:SOT-6 其它名稱:MAX1836EUT33#TG16DKR |
| EL7566DREZ | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 EL7566DREZ 6 AMP DC: DC STP DWNG RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| EL7566DREZ-T13 | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 EL7566DREZ 6 AMP DC: DC STP DWNG RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| EL7566DREZ-T7 | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 EL7566DREZ 6 AMP DC: DC STP DWNG RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| EL7571 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Programmable PWM Controller |
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