All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certificati" />
參數(shù)資料
型號: EL8188IW-T7A
廠商: Intersil
文件頁數(shù): 6/14頁
文件大?。?/td> 0K
描述: IC OPAMP SGL MICROPOWER SOT23-6
標(biāo)準(zhǔn)包裝: 250
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.15 V/µs
增益帶寬積: 266kHz
電流 - 輸入偏壓: 1pA
電壓 - 輸入偏移: 50µV
電流 - 電源: 55µA
電流 - 輸出 / 通道: 31mA
電壓 - 電源,單路/雙路(±): 2.4 V ~ 5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應(yīng)商設(shè)備封裝: SOT-23-6
包裝: 帶卷 (TR)
14
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7467.7
February 24, 2011
EL8188
Wafer Level Chip Scale Package (WLCSP)
PIN 1 ID
A
E1
BOTTOM VIEW
CB
A
b
D1
SIDE VIEW
A1
A2
TOP VIEW
D
E
SD
2
1
e
SE
b
W3x2.6C
3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL
MILLIMETERS
A
0.51 Min, 0.55 Max
A1
0.225 ±0.015
A2
0.305 ±0.013
b
Φ0.323 ±0.025
D
0.955 ±0.020
D1
0.50 BASIC
E
1.455 ±0.020
E1
1.00 BASIC
e
0.50 BASIC
SD
0.25 BASIC
SE
0.00 BASIC
Rev. 3 03/08
NOTES:
1. All dimensions are in millimeters.
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