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FN7331.4
October 3, 2005
FIGURE 37. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 38. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 39. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 40. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Typical Performance Curves
(Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
1
0.4
0
0
25
50
75
100
150
AMBIENT TEMPERATURE (°C)
P
85
1.087W
0.8
0.2
0.6
543mW
125
θ
JA
=115°CW
MSOP810
θ
JA
=230°C/W
SOT23-5/6
1.116W
θ
JA
=112°C/W
QSOP16
1.136W
θ
JA
=110°C/W
SO8
1.4
0.8
0.6
0.2
0
0
25
50
75
100
150
AMBIENT TEMPERATURE (°C)
P
125
85
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.4
1
1.2
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.7
0.6
0.4
0.3
0.2
0.1
0
0
25
50
75
100
150
AMBIENT TEMPERATURE (°C)
P
85
607mW
θ
JA
=206°C/W
MSOP8/10
0.5
488mW
θ
JA
=256°C/W
SOT23-5/6
125
791mW
θ
JA
=158°C/W
QSOP16
781mW
θ
JA
=160°C/W
SO8
1
0.8
0.6
0.2
0
0
25
50
75
100
150
AMBIENT TEMPERATURE (°C)
P
125
85
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.4
EL5102, EL5103, EL5202, EL5203, EL5302