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參數(shù)資料
| 型號： | EN5311QI |
| 廠商： | ENPIRION INC |
| 元件分類： | 穩(wěn)壓器 |
| 中文描述： | 1 A SWITCHING REGULATOR, 4000 kHz SWITCHING FREQ-MAX, QCC20 |
| 封裝： | 5 X 5 MM, 1.10 MM HEIGHT, HAOLGEN FREE AND ROHS COMPLIANT, QFN-20 |
| 文件頁數(shù)： | 4/16頁 |
| 文件大?。?/td> | 290K |
| 代理商： | EN5311QI |
03799
11/24/2009
Rev:B
EN5311QI
Enpirion 2009 all rights reserved, E&OE
12
www.enpirion.com
the thermal pad, to the PCB ground on layer 2 (1st layer below PCB surface). The right side of the
figure shows the layout with the components populated. Note the placement of the vias per
recommendation 3.
Vias to Ground Plane
Thermal Vias to Ground Plane
Vias to Ground Plane
Thermal Vias to Ground Plane
Figure 8. Example layout showing PCB top layer, as well as demonstrating use of vias from input, output filter
capacitor local grounds, and thermal pad, to PCB system ground.
Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom of Package
Enpirion has developed a break-through in package technology that utilizes the lead frame as part of
the electrical circuit. The lead frame offers many advantages in thermal performance, in reduced
electrical lead resistance, and in overall foot print. However, it does require some special
considerations.
As part of the package assembly process, lead frame construction requires that for mechanical
support, some of the lead-frame cantilevers be exposed at the point where wire-bond or internal
passives are attached. This results in several small pads being exposed on the bottom of the
package.
Only the large thermal pad and the perimeter pin pads are to be mechanically or electrically
connected to the PC board. The PCB top layer under the EN5311QI should be clear of any metal
except for the large thermal pad. The “grayed-out” area in Figure 9 represents the area that should
be clear of any metal (traces, vias, or planes), on the top layer of the PCB.
NOTE:
Clearance between the various exposed metal pads, the thermal ground pad, and the
perimeter pins, meets or exceeds JEDEC requirements for lead frame package construction (JEDEC
MO-220, Issue J, Date May 2005). The separation between the large thermal pad and the nearest
adjacent metal pad or pin is a minimum of 0.20mm, including tolerances. This is shown in Figure 10.
C
IN
Package
Outline
C
OUT
C
IN
Package
Outline
C
OUT
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| EN5311QI-E | 功能描述:電源管理IC開發(fā)工具 Eval Board EN5311QI 1A Sync. Buck Convtr RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
| EN5312Q | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Fully Integrated Voltage Mode Synchronous Buck PWM DC-DC Converter Module |
| EN5312QI | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 1A Sync Buck Reg w/ Integrated Inductor RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| EN5312QI-E | 功能描述:電源管理IC開發(fā)工具 1A Synchronous Buck Regulator Eval Board RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
| EN5312QI-T | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 1A Sync Buck Reg RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
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