
1–4
Altera Corporation
Stratix Device Handbook, Volume 1
July 2005
Features
Stratix devices are available in space-saving FineLine BGA and ball-grid
array (BGA) packages (see
Tables 1–3 through
1–5). All Stratix devices
support vertical migration within the same package (for example, you
can migrate between the EP1S10, EP1S20, and EP1S25 devices in the 672-
pin BGA package). Vertical migration means that you can migrate to
devices whose dedicated pins, configuration pins, and power pins are the
same for a given package across device densities. For I/O pin migration
across densities, you must cross-reference the available I/O pins using
the device pin-outs for all planned densities of a given package type to
identify which I/O pins are migrational. The Quartus II software can
automatically cross reference and place all pins except differential pins
for migration when given a device migration list. You must use the pin-
outs for each device to verify the differential placement migration. A
future version of the Quartus II software will support differential pin
migration.
Table 1–3. Stratix Package Options & I/O Pin Counts
Device
672-Pin
BGA
956-Pin
BGA
484-Pin
FineLine
BGA
672-Pin
FineLine
BGA
780-Pin
FineLine
BGA
1,020-Pin
FineLine
BGA
1,508-Pin
FineLine
BGA
EP1S10
345
335
345
426
EP1S20
426
361
426
586
EP1S25
473
597
706
EP1S30
683
597
726
EP1S40
683
615
773
822
EP1S60
683
773
1,022
EP1S80
683
773
1,203
(1)
All I/O pin counts include 20 dedicated clock input pins (clk[15..0]p, clk0n, clk2n, clk9n, and clk11n)
that can be used for data inputs.
Table 1–4. Stratix BGA Package Sizes
Dimension
672 Pin
956 Pin
Pitch (mm)
1.27
Area (mm2)
1,225
1,600
Length
× width (mm × mm)
35
× 35
40
× 40