參數(shù)資料
型號： EP4CE15F17C6
廠商： Altera
文件頁數(shù)： 13/42頁
文件大?。?/td> 0K
描述： IC CYCLONE IV FPGA 15K 256FBGA
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
Cyclone IV FPGA Family Overview
特色產(chǎn)品： Cyclone? IV FPGAs
標(biāo)準(zhǔn)包裝： 90
系列： CYCLONE® IV E
LAB/CLB數(shù)： 963
邏輯元件/單元數(shù)： 15408
RAM 位總計： 516096
輸入/輸出數(shù)： 165
電源電壓： 1.15 V ~ 1.25 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 256-BGA
供應(yīng)商設(shè)備封裝： 256-FBGA（17x17）
1–20
Chapter 1: Cyclone IV Device Datasheet
Switching Characteristics
December 2013
Altera Corporation
PLD-Transceiver Interface
Interface speed
(F324 and smaller
package)
—
25
—
125
25
—
125
25
—
125
MHz
Interface speed
(F484 and larger
package)
—
25
—
156.25
25
—
156.25
25
—
156.25
MHz
Digital reset pulse
width
—
Minimum is 2 parallel clock cycles
Notes to Table 1–21:
(1) This specification is valid for transmitter output jitter specification with a maximum total jitter value of 112 ps, typically for 3.125 Gbps SRIO and XAUI
protocols.
(2) The minimum reconfig_clk frequency is 2.5 MHz if the transceiver channel is configured in Transmitter Only mode. The minimum reconfig_clk frequency
is 37.5 MHz if the transceiver channel is configured in Receiver Only or Receiver and Transmitter mode.
(3) The device cannot tolerate prolonged operation at this absolute maximum.
(4) The rate matcher supports only up to ±300 parts per million (ppm).
(5) Supported for the N148, F169, and F324 device packages only.
(6) Supported for the F484, F672, and F896 device packages only. Pending device characterization.
(7) To support CDR ppm tolerance greater than ±300 ppm, implement ppm detector in user logic and configure CDR to Manual Lock Mode.
(8) Asynchronous spread-spectrum clocking is not supported.
(9) For the EP4CGX30 (F484 package only), EP4CGX50, and EP4CGX75 devices, the CDR ppl tolerance is ±200 ppm.
(10) Time taken until pll_locked goes high after pll_powerdown deasserts.
(11) Time that the CDR must be kept in lock-to-reference mode after rx_analogreset deasserts and before rx_locktodata is asserted in manual mode.
(12) Time taken to recover valid data after the rx_locktodata signal is asserted in manual mode (Figure 1–2), or after rx_freqlocked signal goes high in
automatic mode (Figure 1–3).
(13) Time taken to recover valid data after the rx_locktodata signal is asserted in manual mode.
(14) Time taken to recover valid data after the rx_freqlocked signal goes high in automatic mode.
(15) To support data rates lower than the minimum specification through oversampling, use the CDR in LTR mode only.
Table 1–21. Transceiver Specification for Cyclone IV GX Devices (Part 4 of 4)
Symbol/
Description
Conditions
C6
C7, I7
C8
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP4CE15F17C6N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Cyclone IV E 963 LABs 165 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CE15F17C7 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Cyclone IV E 963 LABs 165 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CE15F17C7N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Cyclone IV E 963 LABs 165 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CE15F17C8 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Cyclone IV E 963 LABs 165 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CE15F17C8L 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Cyclone IV E 963 LABs 165 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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