參數(shù)資料
型號: EP4S100G3F45I3
廠商: Altera
文件頁數(shù): 12/22頁
文件大?。?/td> 0K
描述: IC STRATIX IV FPGA 290K 1932FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 3
系列: STRATIX® IV GT
LAB/CLB數(shù): 11648
邏輯元件/單元數(shù): 291200
RAM 位總計: 17661952
輸入/輸出數(shù): 781
電源電壓: 0.92 V ~ 0.98 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 1932-BBGA
供應(yīng)商設(shè)備封裝: 1932-FBGA(45x45)
1–2
Chapter 1: Overview for the Stratix IV Device Family
Feature Summary
September 2012
Altera Corporation
Feature Summary
The following list summarizes the Stratix IV device family features:
Up to 48 full-duplex CDR-based transceivers in Stratix IV GX and GT devices
supporting data rates up to 8.5 Gbps and 11.3 Gbps, respectively
Dedicated circuitry to support physical layer functionality for popular serial
protocols, such as PCI Express (PCIe) (PIPE) Gen1 and Gen2, Gbps Ethernet (GbE),
Serial RapidIO, SONET/SDH, XAUI/HiGig, (OIF) CEI-6G, SD/HD/3G-SDI, Fibre
Channel, SFI-5, and Interlaken
Complete PCIe protocol solution with embedded PCIe hard IP blocks that
implement PHY-MAC layer, Data Link layer, and Transaction layer functionality
f For more information, refer to the IP Compiler for PCI Express User Guide.
Programmable transmitter pre-emphasis and receiver equalization circuitry to
compensate for frequency-dependent losses in the physical medium
Typical physical medium attachment (PMA) power consumption of 100 mW at
3.125 Gbps and 135 mW at 6.375 Gbps per channel
72,600 to 813,050 equivalent LEs per device
7,370 to 33,294 Kb of enhanced TriMatrix memory consisting of three RAM block
sizes to implement true dual-port memory and FIFO buffers
High-speed digital signal processing (DSP) blocks configurable as 9 x 9-bit,
12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multipliers at up to 600 MHz
Up to 16 global clocks (GCLK), 88 regional clocks (RCLK), and 132 periphery
clocks (PCLK) per device
Programmable power technology that minimizes power while maximizing device
performance
Up to 1,120 user I/O pins arranged in 24 modular I/O banks that support a wide
range of single-ended and differential I/O standards
Support for high-speed external memory interfaces including DDR, DDR2,
DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular
I/O banks
High-speed LVDS I/O support with serializer/deserializer (SERDES), dynamic
phase alignment (DPA), and soft-CDR circuitry at data rates up to 1.6 Gbps
Support for source-synchronous bus standards, including SGMII, GbE, SPI-4
Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI, and CSIX-L1
Pinouts for Stratix IV E devices designed to allow migration of designs from
Stratix III to Stratix IV E with minimal PCB impact
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP4S100G3F45I3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV 11648 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4S100G4F45I1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV 14144 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4S100G4F45I1N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV 14144 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4S100G4F45I2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV 14144 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4S100G4F45I2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix IV 14144 LABs 781 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256