參數(shù)資料
型號: EPF10K100ABC356-2
廠商: Altera
文件頁數(shù): 84/128頁
文件大?。?/td> 0K
描述: IC FLEX 10KA FPGA 100K 356-BGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 24
系列: FLEX-10K®
LAB/CLB數(shù): 624
邏輯元件/單元數(shù): 4992
RAM 位總計(jì): 24576
輸入/輸出數(shù): 274
門數(shù): 158000
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 356-BGA
供應(yīng)商設(shè)備封裝: 356-BGA(35x35)
Altera Corporation
59
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 28. Synchronous Bidirectional Pin External Timing Model
Tables 32 through 36 describe the FLEX 10K device internal timing
parameters. These internal timing parameters are expressed as worst-case
values. Using hand calculations, these parameters can be used to estimate
design performance. However, before committing designs to silicon,
actual worst-case performance should be modeled using timing
simulation and analysis. Tables 37 through 38 describe FLEX 10K external
timing parameters.
PRN
CLRN
DQ
PRN
CLRN
DQ
PRN
CLRN
DQ
Dedicated
Clock
Bidirectional
Pin
Output Register
tINSUBIDIR
tOUTCOBIDIR
tXZBIDIR
tZXBIDIR
tINHBIDIR
OE Register
Input Register
Table 32. LE Timing Microparameters (Part 1 of 2)
Symbol
Parameter
Conditions
tLUT
LUT delay for data-in
tCLUT
LUT delay for carry-in
tRLUT
LUT delay for LE register feedback
tPACKED
Data-in to packed register delay
tEN
LE register enable delay
tCICO
Carry-in to carry-out delay
tCGEN
Data-in to carry-out delay
tCGENR
LE register feedback to carry-out delay
tCASC
Cascade-in to cascade-out delay
tC
LE register control signal delay
tCO
LE register clock-to-output delay
tCOMB
Combinatorial delay
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EPF10K100ABC356-2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 624 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K100ABC356-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 624 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K100ABC356-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 624 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K100ABC600-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 624 LABs 406 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K100ABC600-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 624 LABs 406 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256