參數(shù)資料
型號(hào)： EPF10K100EBC356-1
廠商： Altera
文件頁(yè)數(shù)： 24/100頁(yè)
文件大小： 0K
描述： IC FLEX 10KE FPGA 100K 356-BGA
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 48
系列： FLEX-10KE®
LAB/CLB數(shù)： 624
邏輯元件/單元數(shù)： 4992
RAM 位總計(jì)： 49152
輸入/輸出數(shù)： 274
門數(shù)： 257000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 356-BGA
供應(yīng)商設(shè)備封裝： 356-BGA（35x35）
Altera Corporation
3
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
■
Software design support and automatic place-and-route provided by
Altera’s development systems for Windows-based PCs and Sun
SPARCstation, and HP 9000 Series 700/800
■
Flexible package options
–
Available in a variety of packages with 144 to 672 pins, including
the innovative FineLine BGATM packages (see Tables 3 and 4)
–SameFrameTM pin-out compatibility between FLEX 10KA and
FLEX 10KE devices across a range of device densities and pin
counts
■
Additional design entry and simulation support provided by EDIF
2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM),
DesignWare components, Verilog HDL, VHDL, and other interfaces
to popular EDA tools from manufacturers such as Cadence,
Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity,
VeriBest, and Viewlogic
Notes:
(1)
FLEX 10KE device package types include thin quad flat pack (TQFP), plastic quad flat pack (PQFP), power quad flat
pack (RQFP), pin-grid array (PGA), and ball-grid array (BGA) packages.
(2)
Devices in the same package are pin-compatible, although some devices have more I/O pins than others. When
planning device migration, use the I/O pins that are common to all devices.
(3)
This option is supported with a 484-pin FineLine BGA package. By using SameFrame pin migration, all
FineLine BGA packages are pin-compatible. For example, a board can be designed to support 256-pin, 484-pin, and
672-pin FineLine BGA packages. The Altera software automatically avoids conflicting pins when future migration
is set.
Table 3. FLEX 10KE Package Options & I/O Pin Count
Device
144-Pin
TQFP
208-Pin
PQFP
240-Pin
PQFP
RQFP
256-Pin
FineLine
BGA
356-Pin
BGA
484-Pin
FineLine
BGA
599-Pin
PGA
600-Pin
BGA
672-Pin
FineLine
BGA
EPF10K30E
102
147
176
220
220 (3)
EPF10K50E
102
147
189
191
254
254 (3)
EPF10K50S
102
147
189
191
220
254
254 (3)
EPF10K100E
147
189
191
274
338
338 (3)
EPF10K130E
186
274
369
424
413
EPF10K200E
470
EPF10K200S
182
274
369
470
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K100EBC356-1DX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC
EPF10K100EBC356-1N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K100EBC356-1X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K100EBC356-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 624 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K100EBC356-2DX 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC
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