參數(shù)資料
型號(hào): EPF10K200SRC240-1X
廠商: Altera
文件頁(yè)數(shù): 33/100頁(yè)
文件大?。?/td> 0K
描述: IC FLEX 10KS FPGA 200K 240-RQFP
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
產(chǎn)品變化通告: Package Change 30/Jun/2010
標(biāo)準(zhǔn)包裝: 24
系列: FLEX-10KE®
LAB/CLB數(shù): 1248
邏輯元件/單元數(shù): 9984
RAM 位總計(jì): 98304
輸入/輸出數(shù): 182
門數(shù): 513000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 240-BFQFP 裸露焊盤
供應(yīng)商設(shè)備封裝: 240-RQFP(32x32)
其它名稱: EPF10K200SRC2401X
38
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
ClockLock &
ClockBoost
Features
To support high-speed designs, FLEX 10KE devices offer optional
ClockLock and ClockBoost circuitry containing a phase-locked loop (PLL)
used to increase design speed and reduce resource usage. The ClockLock
circuitry uses a synchronizing PLL that reduces the clock delay and skew
within a device. This reduction minimizes clock-to-output and setup
times while maintaining zero hold times. The ClockBoost circuitry, which
provides a clock multiplier, allows the designer to enhance device area
efficiency by resource sharing within the device. The ClockBoost feature
allows the designer to distribute a low-speed clock and multiply that clock
on-device. Combined, the ClockLock and ClockBoost features provide
significant improvements in system performance and bandwidth.
All FLEX 10KE devices, except EPF10K50E and EPF10K200E devices,
support ClockLock and ClockBoost circuitry. EPF10K50S and
EPF10K200S devices support this circuitry. Devices that support Clock-
Lock and ClockBoost circuitry are distinguished with an “X” suffix in the
ordering code; for instance, the EPF10K200SFC672-1X device supports
this circuit.
The ClockLock and ClockBoost features in FLEX 10KE devices are
enabled through the Altera software. External devices are not required to
use these features. The output of the ClockLock and ClockBoost circuits is
not available at any of the device pins.
The ClockLock and ClockBoost circuitry locks onto the rising edge of the
incoming clock. The circuit output can drive the clock inputs of registers
only; the generated clock cannot be gated or inverted.
The dedicated clock pin (GCLK1) supplies the clock to the ClockLock and
ClockBoost circuitry. When the dedicated clock pin is driving the
ClockLock or ClockBoost circuitry, it cannot drive elsewhere in the device.
For designs that require both a multiplied and non-multiplied clock, the
clock trace on the board can be connected to the GCLK1 pin. In the
Altera software, the GCLK1 pin can feed both the ClockLock and
ClockBoost circuitry in the FLEX 10KE device. However, when both
circuits are used, the other clock pin cannot be used.
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EPF10K200SRC240-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 182 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SRC240-2X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 182 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SRC240-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 182 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K200SRC240-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 1248 LABs 182 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K20RC208-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 144 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256