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參數(shù)資料
型號(hào): EPF10K20RC208-4
廠商: Altera
文件頁數(shù): 86/128頁
文件大?。?/td> 0K
描述: IC FLEX 10K FPGA 20K 208-RQFP
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
產(chǎn)品變化通告: Package Change 30/Jun/2010
標(biāo)準(zhǔn)包裝: 48
系列: FLEX-10K®
LAB/CLB數(shù): 144
邏輯元件/單元數(shù): 1152
RAM 位總計(jì): 12288
輸入/輸出數(shù): 147
門數(shù): 63000
電源電壓: 4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 208-BFQFP 裸露焊盤
供應(yīng)商設(shè)備封裝: 240-RQFP(32x32)
產(chǎn)品目錄頁面: 603 (CN2011-ZH PDF)
其它名稱: 544-2209
60
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
tSU
LE register setup time for data and enable signals before clock; LE register
recovery time after asynchronous clear, preset, or load
tH
LE register hold time for data and enable signals after clock
tPRE
LE register preset delay
tCLR
LE register clear delay
tCH
Minimum clock high time from clock pin
tCL
Minimum clock low time from clock pin
Table 33. IOE Timing Microparameters
Symbol
Parameter
Conditions
tIOD
IOE data delay
tIOC
IOE register control signal delay
tIOCO
IOE register clock-to-output delay
tIOCOMB
IOE combinatorial delay
tIOSU
IOE register setup time for data and enable signals before clock; IOE register
recovery time after asynchronous clear
tIOH
IOE register hold time for data and enable signals after clock
tIOCLR
IOE register clear time
tOD1
Output buffer and pad delay, slow slew rate = off, VCCIO = VCCINT
C1 = 35 pF (2)
tOD2
Output buffer and pad delay, slow slew rate = off, VCCIO = low voltage
C1 = 35 pF (3)
tOD3
Output buffer and pad delay, slow slew rate = on
C1 = 35 pF (4)
tXZ
IOE output buffer disable delay
tZX1
IOE output buffer enable delay, slow slew rate = off, VCCIO = VCCINT
C1 = 35 pF (2)
tZX2
IOE output buffer enable delay, slow slew rate = off, VCCIO = low voltage
C1 = 35 pF (3)
tZX3
IOE output buffer enable delay, slow slew rate = on
C1 = 35 pF (4)
tINREG
IOE input pad and buffer to IOE register delay
tIOFD
IOE register feedback delay
tINCOMB
IOE input pad and buffer to FastTrack Interconnect delay
Table 32. LE Timing Microparameters (Part 2 of 2)
Note (1)
Symbol
Parameter
Conditions
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF10K20RC208-4N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 144 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K20RC240-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 144 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K20RC240-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 144 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K20RC240-4 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 144 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K20RC240-4N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 144 LABs 189 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256