Notes to tables: (1) Microparameters are timing delays cont" />
參數(shù)資料
型號： EPF10K50VBI356-4
廠商： Altera
文件頁數(shù)： 90/128頁
文件大?。?/td> 0K
描述： IC FLEX 10KV FPGA 50K 356-BGA
產(chǎn)品培訓模塊： Three Reasons to Use FPGA's in Industrial Designs
標準包裝： 24
系列： FLEX-10K®
LAB/CLB數(shù)： 360
邏輯元件/單元數(shù)： 2880
RAM 位總計： 20480
輸入/輸出數(shù)： 274
門數(shù)： 116000
電源電壓： 3 V ~ 3.6 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 356-BGA
供應商設備封裝： 356-BGA（35x35）
64
Altera Corporation
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Notes to tables:
(1)
Microparameters are timing delays contributed by individual architectural elements. These parameters cannot be
measured explicitly.
(2)
Operating conditions: VCCIO = 5.0 V ± 5% for commercial use in FLEX 10K devices.
VCCIO = 5.0 V ± 10% for industrial use in FLEX 10K devices.
VCCIO = 3.3 V ± 10% for commercial or industrial use in FLEX 10KA devices.
(3)
Operating conditions: VCCIO = 3.3 V ± 10% for commercial or industrial use in FLEX 10K devices.
VCCIO = 2.5 V ± 0.2 V for commercial or industrial use in FLEX 10KA devices.
(4)
Operating conditions: VCCIO = 2.5 V, 3.3 V, or 5.0 V.
(5)
Because the RAM in the EAB is self-timed, this parameter can be ignored when the WE signal is registered.
(6)
EAB macroparameters are internal parameters that can simplify predicting the behavior of an EAB at its boundary;
these parameters are calculated by summing selected microparameters.
(7)
These parameters are worst-case values for typical applications. Post-compilation timing simulation and timing
analysis are required to determine actual worst-case performance.
(8)
External reference timing parameters are factory-tested, worst-case values specified by Altera. A representative
subset of signal paths is tested to approximate typical device applications.
(9)
Contact Altera Applications for test circuit specifications and test conditions.
(10) These timing parameters are sample-tested only.
Figures 29 and 30 show the asynchronous and synchronous timing
waveforms, respectively, for the EAB macroparameters in Table 34.
Figure 29. EAB Asynchronous Timing Waveforms
EAB Asynchronous Write
EAB Asynchronous Read
WE
a0
d0
d3
tEABRCCOMB
a1
a2
a3
d2
tEABAA
d1
Address
Data-Out
WE
a0
din1
dout2
tEABDD
a1
a2
din1
din0
tEABWCCOMB
tEABWASU
tEABWAH
tEABWDH
tEABWDSU
tEABWP
din0
Data-In
Address
Data-Out
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EPF10K50VBI356-4N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 360 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K50VFC484-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 360 LABs 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K50VFC484-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 360 LABs 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K50VFC484-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 360 LABs 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K50VFC484-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 360 LABs 246 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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