參數(shù)資料
型號(hào): EPF6024AFI256-2
廠商: Altera
文件頁(yè)數(shù): 30/52頁(yè)
文件大?。?/td> 0K
描述: IC FLEX 6000 FPGA 24K 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: FLEX 6000
LAB/CLB數(shù): 196
邏輯元件/單元數(shù): 1960
輸入/輸出數(shù): 219
門數(shù): 24000
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-FBGA(17x17)
36
Altera Corporation
FLEX 6000 Programmable Logic Device Family Data Sheet
Timing Model
The continuous, high-performance FastTrack Interconnect routing
resources ensure predictable performance and accurate simulation and
timing analysis. This predictable performance contrasts with that of
FPGAs, which use a segmented connection scheme and therefore have
unpredictable performance.
Device performance can be estimated by following the signal path from a
source, through the interconnect, to the destination. For example, the
registered performance between two LEs on the same row can be
calculated by adding the following parameters:
LE register clock-to-output delay (tCO + tREG_TO_OUT)
Routing delay (tROW + tLOCAL)
LE LUT delay (tDATA_TO_REG)
LE register setup time (tSU)
The routing delay depends on the placement of the source and destination
LEs. A more complex registered path may involve multiple combinatorial
LEs between the source and destination LEs.
Timing simulation and delay prediction are available with the Simulator
and Timing Analyzer, or with industry-standard EDA tools. The
Simulator offers both pre-synthesis functional simulation to evaluate logic
design accuracy and post-synthesis timing simulation with 0.1-ns
resolution. The Timing Analyzer provides point-to-point timing delay
information, setup and hold time analysis, and device-wide performance
analysis.
Figure 19 shows the overall timing model, which maps the possible
routing paths to and from the various elements of the FLEX 6000 device.
相關(guān)PDF資料
PDF描述
EPF6024ABI256-2 IC FLEX 6000 FPGA 24K 256-BGA
AMM28DTBT CONN EDGECARD 56POS R/A .156 SLD
EPF6016AQI208-2 IC FLEX 6000 FPGA 16K 208-PQFP
AMM28DTAT CONN EDGECARD 56POS R/A .156 SLD
ABC60DRYI-S734 CONN EDGECARD 120PS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF6024AQC208-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-1N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-2N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AQC208-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 6000 196 LABs 171 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256