Revision 10 1-19 Power Dissipation Power consumption for eX devices can be divided into two components: static and dynamic. Static" />
參數(shù)資料
型號： EX64-TQ64
廠商： Microsemi SoC
文件頁數(shù)： 16/48頁
文件大?。?/td> 0K
描述： IC FPGA ANTIFUSE 3K 64-TQFP
標準包裝： 160
系列： EX
邏輯元件/單元數(shù)： 128
輸入/輸出數(shù)： 41
門數(shù)： 3000
電源電壓： 2.3 V ~ 2.7 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 64-LQFP
供應(yīng)商設(shè)備封裝： 64-TQFP（10x10）
eX Family FPGAs
Revision 10
1-19
Power Dissipation
Power consumption for eX devices can be divided into two components: static and dynamic.
Static Power Component
The power due to standby current is typically a small component of the overall power. Typical standby
current for eX devices is listed in the Table 1-11 on page 1-16. For example, the typical static power for
eX128 at 3.3 V VCCI is:
ICC * VCCA = 795 A x 2.5 V = 1.99 mW
Dynamic Power Component
Power dissipation in CMOS devices is usually dominated by the dynamic power dissipation. This
component is frequency-dependent and a function of the logic and the external I/O. Dynamic power
dissipation results from charging internal chip capacitance due to PC board traces and load device
inputs. An additional component of the dynamic power dissipation is the totem pole current in the CMOS
transistor pairs. The net effect can be associated with an equivalent capacitance that can be combined
with frequency and voltage to represent dynamic power dissipation.
Dynamic power dissipation = CEQ * VCCA2 x F
where:
Equivalent capacitance is calculated by measuring ICCA at a specified frequency and voltage for each
circuit component of interest. Measurements have been made over a range of frequencies at a fixed
value of VCC. Equivalent capacitance is frequency-independent, so the results can be used over a wide
range of operating conditions. Equivalent capacitance values are shown below.
CEQ Values for eX Devices
The variable and fixed capacitance of other device components must also be taken into account when
estimating the dynamic power dissipation.
Table 1-12 shows the capacitance of the clock components of eX devices.
CEQ = Equivalent capacitance
F
= switching frequency
Combinatorial modules (Ceqcm)
1.70 pF
Sequential modules (Ceqsm)
1.70 pF
Input buffers (Ceqi)
1.30 pF
Output buffers (Ceqo)
7.40 pF
Routed array clocks (Ceqcr)
1.05 pF
Table 1-12 Capacitance of Clock Components of eX Devices
eX64
eX128
eX256
Dedicated array clock – variable (Ceqhv)
0.85 pF
Dedicated array clock – fixed (Ceqhf)
18.00 pF
20.00 pF
25.00 pF
Routed array clock A (r1)
23.00 pF
28.00 pF
35.00 pF
Routed array clock B (r2)
23.00 pF
28.00 pF
35.00 pF
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EX64-TQ64A 功能描述:IC FPGA ANTIFUSE 3K 64-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
EX64-TQ64I 功能描述:IC FPGA ANTIFUSE 3K 64-TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
EX64-TQG100 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
EX64-TQG100A 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
EX64-TQG100I 功能描述:IC FPGA ANTIFUSE 3K 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
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