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參數(shù)資料
| 型號(hào)： | EYTF2CSTT |
| 英文描述： | Buletooth Module |
| 中文描述： | Buletooth模塊 |
| 文件頁數(shù)： | 5/14頁 |
| 文件大?。?/td> | 254K |
| 代理商： | EYTF2CSTT |
2.
4M
A
X
0.
7
+0
.1
-0
.1
34+0.3
-0.3
1.5X9
6
3.5
1.5X5
15
.6
+0
.3
-0
.3
1
16
17
32
PRELIMINARY
Class1 UART Full Module
EYSF1UA**, EYSF1UA**-**
Bluetooth Module
TAIYO YUDEN
Aug./2004 Ver.1.0
General Electrical Specification
DH5 packet , 921.6kbps,HCI,
TX=Max Power,VDD=3.3V
V
3.4
3.3
3.2
Operating Voltage (VDD_PA)
mA
180
135
Continues TX, ,VDD=3.3V
Peak Current
mA
56
Receive, (Slave)
Average Current Consumption 3
mA
0.9
Deep Sleep ,VDD=3.3V
Average Current Consumption 4
deg-C
+70
-20
General Operating temperature condition
V
0.4
-
Output Low Voltage
V
-
0.8VDD
Input High Voltage
V
-
VDD-0.6
Output High Voltage
mA
95
Send ,(Master)
Average Current Consumption 2
mA
43
Audio with HV3 ,VDD=3.3V ,
TX=Max Power, Slave
Average Current Consumption 1
V
0.2VDD
-
UART,PCM,GPIO
Input Low Voltage
-
5:1
No abnormal Oscillation
Load Impedance
dBm
-70
-81
RX Sensitivity
dBm
+20
+17
measured in 50 ohm,VDD_PA=VDD=3.3V
RF Output Power
V
VDD_PA
3.2
Operating Voltage (VDD)
GHz
2.480
2.402
Carrier Frequency
Units
Max.
Typ.
Min.
Description
Parameter
Block Diagram
Unit;mm
Features
PC peripheral equipment
Home Network , AV
Access Point , FA etc
Applications
Outline
Note: The above PRELIMINARY data are not guaranteed and are subject to change without notice.
The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by TAIYO YUDEN CO., LTD. is under license.
FLASH
ROM
RADIO
MATCHING
B.P.F
CRYSTAL
MHz
32
ARM7 TDMI
ROM / RAM
BB
PCM
PCM (4) UART (4) GPIO (4)
UART
GPIO
VDD
CRYSTAL
kHz
32
RESET
GND
JTAG (5)
VOLTAGE
REGULATOR
SW
MATCHING
PA
L.P.F
VDD_PA
JTAG
VOLTAGE
REGULATOR
The module is a Max.20dBm( Class1 ) module.
Bluetooth standard Ver1.2(Mandatory) conformity.
( Ready for Optional Ver1.2 features )
Internal baseband clock oscillator.
Support functions
SCO links,ACL links,Piconet<7>,Hold,Sniff,Park,
Power Control
Interface:UART,PCM,GPIO
Protocol stack:
Under HCI firmware Type,
GAP+SDP+SPP+DUN+FAX+OPP+GOEP+HSP,
A2DP+AVRCP+AVDTP+GAVDP+AVCTP+(HSP),
HCRP+BIP +OPP+GOEP Stacked Type , etc
Small outline.
34.0 x 15.6 x 2.4 mm
RoHS regulation substance (Pb.Cd.Hg.Cr+6.PBB.PBDE) :
Non use
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