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參數(shù)資料
| 型號(hào)： | FAB2200UCX |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA25 |
| 封裝： | 0.40 MM PITCH, WLCSP-25 |
| 文件頁數(shù)： | 26/33頁 |
| 文件大?。?/td> | 948K |
| 代理商： | FAB2200UCX |
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2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAB2200 Rev. 1.0.1
32
FAB2200
—
Audio
Subsystem
with
St
ereo
Class-G
Headph
on
eAmplifier
Physical Dimensions
Figure 27. 25-Bump, 0.4mm Pitch, Wafer-Level Chip-Scale Package (WLCSP)
Product
D
E
X
Y
FAB2200UCX
2.06mm
2.38mm
0.39mm
0.23mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent version. Package specifications do not expand Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent packaging drawings and tape and reel
specifications http://www.fairchildsemi.com/packaging/.
BALL A1
INDEX AREA
1 2 3 4 5
A
B
C
D
E
SEATING PLANE
25X
A1
0.005
CA B
F
0.260±0.02
0.40
1.60
0.40
1.60
(X) ±0.018
(Y) ±0.018
E
D
0.06 C
0.05 C
E
D
F
0.378±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC025AArev2.
0.03 C
2X
0.03 C
2X
C
B
A
0.625
0.547
0.40
1.60
0.40
1.60
(0.200)
Cu Pad
(0.300)
Solder Mask
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
TOP VIEW
BOTTOM VIEW
SIDE VIEWS
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