參數(shù)資料
型號: FBGA
英文描述: FBGA - FBGA User's Guide. Version 4.2
中文描述: FBGA封裝- FBGA封裝用戶指南。版本4.2
文件頁數(shù): 11/97頁
文件大?。?/td> 2624K
代理商: FBGA
FBGA User’s Guide
10
Version 4.2, November 1, 2002
will stride to reduce die sizes. AMD’s FBGA packages allow smaller, lower cost die to be placed in
the same package without affecting package dimensions or requiring PC board redesigns.
The Impact of Die Size Changes on FBGA Package Size
The minimum distance between balls on the FBGA, the ball pitch, great affects an OEM’s PC board
technology and system routing complexity. Device with ball pitches of 0.8mm can be easily be routed
with today’s widely used and cost effect PC board technology (FR4 with 0.005 inch lines and spaces).
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參數(shù)描述
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FBGC-3-1.4G 制造商:MERRIMAC 制造商全稱:MERRIMAC 功能描述:FILTER